NEC 78K0 User Manual page 460

Table 29-1. Surface Mounting Type Soldering Conditions (2/2)
µ
PD78F0114M1GB-8ES, 78F0114M2GB-8ES, 78F0114M3GB-8ES, 78F0114M4GB-8ES, 78F0114M5GB-8ES,
µ
PD
78F0114M6GB-8ES, 78F0114M1GB(A)-8ES, 78F0114M2GB(A)-8ES, 78F0114M3GB(A)-8ES,
µ
PD 78F0114M4GB(A)-8ES, 78F0114M5GB(A)-8ES, 78F0114M6GB(A)-8ES, 78F0114M1GB(A1)-8ES,
µ
PD 78F0114M2GB(A1)-8ES, 78F0114M5GB(A1)-8ES, 78F0114M6GB(A1)-8ES
Soldering Method
Infrared reflow Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Count: Twice or less, Exposure limit: 3 days
hours)
VPS Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or higher),
Count: Twice or less, Exposure limit: 3 days
hours)
Wave soldering Solder bath temperature: 260°C max., Time: 10 seconds max., Count: Once,
Preheating temperature: 120°C max. (package surface temperature), Exposure
limit: 3 days
Partial heating Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
460
CHAPTER 29 RECOMMENDED SOLDERING CONDITIONS
Soldering Conditions
Note
(after that, prebake at 125°C for 10 hours)
User's Manual U16227EJ2V0UD
Note
(after that, prebake at 125°C for 10
Note
(after that, prebake at 125°C for 10
Recommended
Condition Symbol
IR35-103-2
VP15-103-2
WS60-103-1
−