Power Subsystem; Mechanical Overview; Figure 12. Power Supply Module Enclosure - Dimensional Drawing - Intel SR1625UR Technical Product Specification

Power Subsystem

3. Power Subsystem
The power subsystem of the system consists of an integrated Power Distribution Module (PDM),
a Power Module Enclosure, and support for up to two 650-W power supply modules. The power
subsystem can be configured to support a single module in a 1+0 non-redundant configuration,
or dual modules in a 1+1 redundant power configuration. In a 1+1 configuration, a single failed
power module can be hot-swapped with the system running. Either configuration supports up to
a maximum of 650 Watts of power.
This chapter provides technical details on the operation of the power supply module and power
subsystem. For additional information, refer to the Intel
Supply Specification and the Intel
Specification.
3.1

Mechanical Overview

Bi-Color LED
(PWR/Fail)
+0.5/-0.5
39.0
Notes:
1. All dimensions are in mm.
2. AC inlet can protrude beyond the front panel of the power supply module.
3. Fans are powered from +12 V when power supplies are ON.
4. Fans are powered from 5 VSB when in standby mode.

Figure 12. Power Supply Module Enclosure - Dimensional Drawing

16
®
Server System SR1625 Power Distribution Module
Fan
+/- 0.5
54.5
Fan
40.25
+/- 0.5 mm
Intel order number E47487-007
Intel® Server System SR1625UR TPS
®
Server System SR1625 AC Power
Airflow direction
+/-0.5
320 mm
Beveled to allow smooth insertion into the system
39 +/- 0.5 mm
Revision 1.5
4.0