List Of Illustrations - Keithley Series 2600 Application Manual

Section 1 General Information
Figure 1-1 . Typical system configuration for applications . . .1-1
Section 2 Two-terminal Device Tests
Figure 2-1 . Series 2600 two-wire connections
(local sensing) . . . . . . . . . . . . . . . . . . . . . . .2-1
Figure 2-2 . Voltage coefficient test configuration . . . . . . .2-1
Figure 2-3 . Test configuration for capacitor leakage test . . .2-3
Figure 2-4 . Staircase sweep . . . . . . . . . . . . . . . . . .2-5
Figure 2-5 . Test configuration for diode characterization . . .2-5
Figure 2-6 . Program 3 results: Diode forward
characteristics . . . . . . . . . . . . . . . . . . . . . . .2-6
Section 3 Bipolar Transistor Tests
Figure 3-1 . Test configuration for common-emitter tests . . 3-1
Figure 3-2 . Program 4 results: Common-emitter
characteristics . . . . . . . . . . . . . . . . . . . . . . 3-3
Figure 3-3 . Gummel plot test configuration . . . . . . . . . 3-4
Figure 3-4 . Program 5 results: Gummel plot . . . . . . . . 3-5
Figure 3-5 . Test configuration for current gain tests
using search method . . . . . . . . . . . . . . . . . . . 3-6
Figure 3-6 . Test configuration for fast current gain tests . . 3-8
Figure 3-7 . Configuration for I
Figure 3-8 . Program 8 results: I
Section 4 FET Tests
Figure 4-1 . Test configuration for common-source tests . . 4-2
Figure 4-2 . Program 9 results: Common-source
characteristics . . . . . . . . . . . . . . . . . . . . . . 4-3
Figure 4-3 . Configuration for transductance tests . . . . . 4-4
Figure 4-4 . Program 10 results: Transconductance vs . V
Figure 4-5 . Program 10 results: Transconductance vs . I
Figure 4-6 . Configuration for search method
threshold tests . . . . . . . . . . . . . . . . . . . . . . 4-6
Figure 4-7 . Configuration for self-bias threshold tests . . . 4-8

List of Illustrations

tests . . . . . . . . . . . 3-11
CEO
vs . V . . . . . . . . . 3-12
CEO CEO
GS
. . 4-5
D
Section 5 Using Substrate Bias
Figure 5-1 . TSP-Link connections for two instruments . . . 5-1
Figure 5-2 . TSP-Link instrument connections . . . . . . . . 5-2
Figure 5-3 . Program 12 test configuration . . . . . . . . . 5-3
Figure 5-4 . Program 12 typical results: I
Figure 5-5 . Program 13 test configuration . . . . . . . . . . 5-5
Figure 5-6 . Program 13 typical results: Common-source
characteristics with substrate bias . . . . . . . . . . . . 5-6
Figure 5-7 . Program 14 test configuration . . . . . . . . . . 5-8
Figure 5-8 . Program 14 typical results: Common-emitter
characteristics with substrate bias . . . . . . . . . . . . 5-9
Section 6 High Power Tests
Figure 6-1 . High current (SMUs in parallel) . . . . . . . . . 6-1
Figure 6-2 . High voltage (SMUs in series) . . . . . . . . . . 6-2
Appendix A Scripts
. 4-5
vs . V . . . . . 5-4
SB GS