NEC PD789860 User Manual page 198

Table 23-1. Surface Mounting Type Soldering Conditions (2/2)
µ
PD78E9860AMC-5A4:
µ
PD78E9861AMC-5A4:
Soldering Method
Infrared reflow Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or
higher), Count: Two times or less, Exposure limit: 3 days
at 125°C for 10 hours)
VPS Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or
higher), Count: Two times or less, Exposure limit: 3 days
125°C for 10 hours)
Wave soldering Solder bath temperature: 260°C max., Time: 10 seconds max., Count: Once,
Preheating temperature: 120°C max. (package surface temperature), Exposure
limit: 3 days
Partial heating Pin temperature: 300°C max. Time: 3 seconds max. (per pin row)
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering method together (except for partial heating).
198
CHAPTER 23 RECOMMENDED SOLDERING CONDITIONS
20-pin plastic SSOP (7.62 mm (300))
20-pin plastic SSOP (7.62 mm (300))
Soldering Conditions
Note
(after that, prebake at 125°C for 10 hours)
User's Manual U14826EJ5V0UD
Condition Symbol
IR35-103-2
Note
(after that, prebake
VP15-103-2
Note
(after that, prebake at
WS60-103-1
Recommended
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