Chapter 23 Recommended Soldering Conditions - NEC PD789860 User Manual

CHAPTER 23 RECOMMENDED SOLDERING CONDITIONS

µ
The PD789860, 789860(A), 789861, 78E9860A, and 78E9861A should be soldered and mounted under the
following recommended conditions.
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index/html)
Table 23-1. Surface Mounting Type Soldering Conditions (1/2)
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PD789860MC-×××-5A4:
µ
PD789861MC-×××-5A4:
µ
PD789860MC(A)-×××-5A4: 20-pin plastic SSOP (7.62 mm (300))
Soldering Method
Infrared reflow Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Count: three times or less
VPS Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or higher),
Count: three times or less
Wave soldering Solder bath temperature: 260°C max., Time: 10 seconds max., Count: Once,
Preheating temperature: 120°C max. (package surface temperature)
Partial heating Pin temperature: 300°C max. Time: 3 seconds max. (per pin row)
Caution Do not use different soldering method together (except for partial heating).
20-pin plastic SSOP (7.62 mm (300))
20-pin plastic SSOP (7.62 mm (300))
Soldering Conditions
User's Manual U14826EJ5V0UD
Recommended
Condition Symbol
IR35-00-3
VP15-00-3
WS60-00-1
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