Table Of Contents - Intel 5100 Series Instruction Manual

Contents
1 Introduction .............................................................................................................. 7
1.1 Objective ........................................................................................................... 7
1.2 Scope ................................................................................................................ 7
1.3 References ......................................................................................................... 7
1.4 Definition of Terms .............................................................................................. 8
2 Thermal/Mechanical Reference Design .................................................................... 11
2.1 Mechanical Requirements ................................................................................... 11
2.1.1 Processor Mechanical Parameters ............................................................. 11
2.1.2 Dual-Core Intel Xeon Processor 5100 Series Processor Package .................... 11
2.1.3 Dual-Core Intel Xeon Processor 5100 Series Considerations ......................... 14
2.2 Processor Thermal Parameters and Features ......................................................... 15
2.2.1 Thermal Control Circuit and TDP............................................................... 15
2.2.2 Digital Thermal Sensor............................................................................ 16
2.2.3 Platform Environmental Control Interface (PECI) ........................................ 16
2.2.4 Multiple Core Special Considerations ......................................................... 17
2.2.5 Thermal Profile ...................................................................................... 20
2.2.6 TCONTROL Definition .............................................................................. 22
2.2.7 Thermal Profile Concepts for the
Dual-Core Intel Xeon Processor 5100 Series............................................... 23
2.2.8 Performance Targets............................................................................... 25
2.3 Characterizing Cooling Solution Performance Requirements..................................... 29
2.3.1 Fan Speed Control .................................................................................. 29
2.3.2 Processor Thermal Characterization Parameter Relationships........................ 31
2.3.3 Chassis Thermal Design Considerations ..................................................... 33
2.4 Thermal/Mechanical Reference Design Considerations ............................................ 33
2.4.1 Heatsink Solutions.................................................................................. 33
2.4.2 Thermal Interface Material....................................................................... 34
2.4.3 Summary .............................................................................................. 35
2.4.4 Assembly Overview of the Intel Reference Thermal Mechanical Design........... 35
2.4.5 Thermal Solution Performance Characteristics ............................................ 37
2.4.6 Thermal Profile Adherence ....................................................................... 39
2.4.7 Components Overview ............................................................................ 43
2.4.8 Boxed Active Thermal Solution for the
Dual-Core Intel Xeon Processor 5100 Series .............................................. 46
A Mechanical Drawings ............................................................................................... 51
B Heatsink Clip Load Methodology .............................................................................. 73
B.1 Overview ......................................................................................................... 73
B.2 Test Preparation................................................................................................ 73
B.2.1 Heatsink Preparation .............................................................................. 73
B.2.2 Typical Test Equipment ........................................................................... 76
B.2.3 Test Procedure Examples ........................................................................ 76
B.2.4 Time-Zero, Room Temperature Preload Measurement ................................. 76
B.2.5 Preload Degradation under Bake Conditions ............................................... 77
C Safety Requirements ............................................................................................... 79
D Quality and Reliability Requirements ....................................................................... 81
D.1 Intel Verification Criteria for the Reference Designs................................................ 81
D.1.1 Reference Heatsink Thermal Verification .................................................... 81
D.1.2 Environmental Reliability Testing .............................................................. 81
D.1.3 Material and Recycling Requirements ........................................................ 83
E Enabled Suppliers Information ................................................................................ 85
Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide 3