General Process Guidelines; Board Preparation - Pace SODRTEK ST 325 Operation And Maintenance Manual

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PCB Component
Designation

General Process Guidelines

Board Preparation

Prepare the land pattern as per your company specifications. The most widely used methods are as
follows:
1. Prefill - The PCB land pattern is prefilled using a soldering iron. Care must be taken to insure that
all lands are tinned with an equal deposition of solder (provides a uniform appearance).
2. Solder Paste - Apply an equal amount of solder paste on each land. Take care to insure that the
proper amount of paste is dispensed. If too much paste is applied, solder bridges will form
between the lands. If an insufficient amount of paste is applied, solder joint formation will be
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Process Mode Profile
(Remove #
or
Install)
Set Blower
Temperature Speed
CycleTime Preheating
(sec.) Required
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