Nozzle Selection - Pace SODRTEK ST 325 Operation And Maintenance Manual

Nozzle Selection

Selection of the proper Nozzle is essential for achieving a quality component removal or installation. Each
ST 325 Nozzle is designed to properly direct the heated air. Custom nozzles are available upon request.
ST 325 Nozzles are available in 4 basic configurations.
Vented Air Nozzles (V-A-N)
Are used for removal/replacement of BGA components.
Box Nozzles
Used for removal/replacement of surface mount components having solder
connections on 4 sides of the component (e.g., QFPs & PLCCs).
Pattern Nozzles
Used for removal/replacement of surface mount components having solder
connections on 2 sides of the component (e.g., SOICs).
Single Jet Nozzles
Available in straight, curved and flat end versions, these nozzles are used for
removal/replacement of small surface mount components (e.g., chip components),
small QFPs, Land Grid Arrays (e.g., those used on pagers & cellular telephones) or
for reflowing solder on single solder connections.
Template Selection
Alignment Templates are used as an aid in aligning V-A-N Nozzles to the PCB Assembly when installing
Ball Grid Arrays (BGAs). The I.D. (Inside Dimension) of the template should
match the perimeter of the BGA land pattern.
Vacuum Cup Selection
Selection of the proper size vacuum cup is important for achieving an adequate
holding force for each component. The cup selected should be as large as
possible without exceeding the body size of the component. Vacuum cups are
consumable items which deteriorate over a period of time.
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