Profile Development - Pace SODRTEK ST 325 Operation And Maintenance Manual

This chart provides a base starting point for the development of exact parameters ("Established Profile Guidelines") for your surface
mount rework process. Initial tests using these references may not result in complete solder reflow. Adjust the reference values as
necessary to obtain desired results. All results should be verified/validated through the use of thermocouples.
Procedure: 1. Select the Component and Substrate which best matches your application.
2. Perform a test using the base parameters.
3. Adjust parameters as desired and perform additional test runs.
4. When desired results are achieved, record process on a copy of Profile Control Chart or Profile Log.
NOTE: Blower Speed parameter is base reference for Reflow function.
Component
Outline
(J Lead)
Component
©2013 PACE Inc., Southern Pines, NC
All Rights Reserved
ST 325 REFLOW PROFILES
SUGGESTED STARTING PARAMETERS
Nozzle
Recommended
Type
Type
Appropriate Size
PBGA
V-A-N Nozzle
PLCC
Appropriate Size
Box Nozzle
Appropriate Size
PQFP
Box Nozzle
Appropriate Size
SOIC
Pattern Nozzle
Appropriate Size
Chip
Single Jet Nozzle
Process Parameter
Remove (Temperature
or and Blower
Install Speed)
Temperature
Remove (° C)
Blower Speed
Temperature
Install (° C)
Blower Speed
Temperature
Remove (° C)
Blower Speed
Temperature
Install (° C)
Blower Speed
Temperature
Remove (° C)
Blower Speed
Temperature
(° C)
Install
Blower Speed
Temperature
Remove (° C)
Blower Speed
Temperature
Install (° C)
Blower Speed
Temperature
Remove
(° C)
Blower Speed
Temperature
Install (° C)
Blower Speed
Substrate (PCB Type)
Medi
Low High
um
Mass Mass
Mass
371 371 371
5 5 5
371 371 371
3 3 4
371 371 371
7 8 8
371 371 371
7 8 8
316 371 371
6 7 7
316 371 371
6 7 7
316 316 371
7 7 7
316 316 371
7 7 7
371 371 371
6 6 8
371 371 371
5 6 7
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Reflow Cycle
Time (sec.)
77
90
30
30
18
18
15
15
11
12