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Mechanical Specifications
3.4
Package Handling Guidelines
Table 3-2
maximum loading on the processor IHS relative to a fixed substrate. These package
handling loads may be experienced during heatsink removal.
Table 3-2.
Package Handling Guidelines
Notes:
1. A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface.
2. These guidelines are based on limited testing for design characterization.
3. A tensile load is defined as a pulling load applied to the IHS in the direction normal to the IHS surface.
4. A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the IHS top
surface.
3.5
Package Insertion Specifications
The Intel
removed from a mPGA604 socket 15 times. The socket should meet the mPGA604
requirements detailed in the mPGA604 Socket Design Guidelines.
3.6
Processor Mass Specifications
The typical mass of the Intel
(1.5oz). This mass [weight] includes all the components that are included in the
package.
3.7
Processor Materials
Table 3-3
Table 3-3.
Processor Materials
Integrated Heat Spreader (IHS)
Document Number: 318080-002
includes a list of guidelines on package handling in terms of recommended
Parameter
Shear
Tensile
Torque
®
®
Xeon
Processor 7200 Series and 7300 Series can be inserted into and
®
Xeon
lists some of the package components and associated materials.
Component
Substrate
Substrate Pins
Maximum Recommended
356 N [80 lbf]
156 N [35 lbf]
8 N-m [70 lbf-in]
®
Processor 7200 Series and 7300 Series is 37.6 g
Material
Nickel Plated Copper
Fiber-Reinforced Resin
Gold Plated Copper
Notes
1, 2
3, 2
4, 2
67
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