Package Handling Guidelines; Package Insertion Specifications; Processor Mass Specifications; Processor Materials - Intel E5205 - Cpu Xeon 1.86Ghz Fsb1066Mhz 6M Lga771 Dual Core Tray Datasheet
Dual-core intel xeon processor 5200 series
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Also See for E5205 - Cpu Xeon 1.86Ghz Fsb1066Mhz 6M Lga771 Dual Core Tray:
- Design manual (100 pages)
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3.4
Package Handling Guidelines
Table 3-2
maximum loading on the processor IHS relative to a fixed substrate. These package
handling loads may be experienced during heatsink removal.
Table 3-2.
Package Handling Guidelines
Parameter
Shear
Tensile
Torque
Notes:
1.
A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface.
2.
A tensile load is defined as a pulling load applied to the IHS in a direction normal to the IHS surface.
3.
A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the IHS top
surface.
4.
These guidelines are based on limited testing for design characterization and incidental applications (one
time only).
5.
Handling guidelines are for the package only and do not include the limits of the processor socket.
3.5
Package Insertion Specifications
The Dual-Core Intel® Xeon® Processor 5200 Series can be inserted and removed 15
times from an LGA771 socket, which meets the criteria outlined in the LGA771 Socket
Design Guidelines.
3.6
Processor Mass Specifications
The typical mass of the Dual-Core Intel® Xeon® Processor 5200 Series is 21.5 grams
[0.76 oz.]. This includes all components which make up the entire processor product.
3.7
Processor Materials
The Dual-Core Intel® Xeon® Processor 5200 Series is assembled from several
components. The basic material properties are described in
Table 3-3.
Processor Materials
Integrated Heat Spreader (IHS)
Substrate
Substrate Lands
3.8
Processor Markings
Figure 3-5
identification of the Dual-Core Intel® Xeon® Processor 5200 Series.
44
includes a list of guidelines on a package handling in terms of recommended
Maximum Recommended
3.95
Component
shows the topside markings on the processor. This diagram aids in the
Units
311
70
111
25
N-m
35
LBF-in
Material
Nickel over copper
Fiber-reinforced resin
Gold over nickel
Mechanical Specifications
Notes
N
1,4,5
lbf
N
2,4,5
lbf
3,4,5
Table
3-3.
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