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3.2
Processor Component Keepout Zones
The processor may contain components on the substrate that define component
keepout zone requirements. A thermal and mechanical solution design must not
intrude into the required keepout zones. Decoupling capacitors are typically mounted
to either the topside or pin-side of the package substrate. See
Figure 3-5
60
for keepout zones.
Mechanical Specifications
Figure 3-4
and
Document Number: 318080-002
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