Intel BFCBASE - Motherboard - 7300 Datasheet page 26

Table 2-9. Voltage and Current Specifications (Sheet 2 of 2)
Symbol
I
TT
I
CC_TDC
I
CC_TDC
I
CC_TDC
I
CC_TDC
I
CC_VTT_OUT
I
CC_GTLREF
I
CC_VCCPLL
I
TCC
I
TCC
I
TCC
I
TCC
Notes:
1. Unless otherwise noted, all specifications in this table apply to all processors and are based on estimates
and simulations, not empirical data. These specifications will be updated with characterized data from
silicon measurements at a later date.
2. These voltages are targets only. A variable voltage source should exist on systems in the event that a
different voltage is required. See
3. The voltage specification requirements are measured across the VCC_SENSE and VSS_SENSE pins and
across the VCC_SENSE2 and VSS_SENSE2 pins with an oscilloscope set to 100 MHz bandwidth, 1.5 pF
maximum probe capacitance, and 1 MΩ minimum impedance. The maximum length of ground wire on the
probe should be less than 5 mm. Ensure external noise from the system is not coupled in the scope probe.
4. The processor must not be subjected to any static V
particular current. Failure to adhere to this specification can shorten processor lifetime.
5. I
CC_MAX
capable of drawing I
current draw over various time durations.
6. FMB is the flexible motherboard guideline. These guidelines are for estimation purposes only. See
Section 2.11.1
7. This specification represents the total current for GTLREF_DATA_MID, GTLREF_DATA_END,
GTLREF_ADD_MID, and GTLREF_ADD_END.
8. V must be provided via a separate voltage source and must not be connected to V
TT
measured at the pin.
26
Parameter
I for V supply before V
CC TT
I for V supply after V
CC TT CC
Thermal Design Current (TDC) Quad-
Core Intel® Xeon® L7345 Processor
Launch - FMB
Thermal Design Current (TDC) Dual-
Core Intel® Xeon® Processor 7200
Series
Launch - FMB
Thermal Design Current (TDC) Intel
®
Xeon Processor 7200 Series and 7300
Series
Launch - FMB
Thermal Design Current (TDC) Intel®
Xeon® X7350 Processor
Launch - FMB
DC current that may be drawn from
V per pin
TT_OUT
I for
CC
GTLREF_DATA_MID,
GTLREF_DATA_END,
GTLREF_ADD_MID, and
GTLREF_ADD_END
I for PLL supply
CC
I for Quad-Core Intel® Xeon® L7345
CC
Processor during active thermal control
circuit (TCC)
I for Dual-Core Intel® Xeon®
CC
Processor 7200 Series during active
thermal control circuit (TCC)
I for Dual-Core Intel® Xeon®
CC
Processor 7200 Series and Quad-Core
Intel® Xeon® Processor 7300 Series
during active thermal control circuit
(TCC)
I for Intel® Xeon® X7350 Processor
CC
during active thermal control circuit
(TCC)
Section 2.4
specification is based on maximum V
for up to 10 ms. Refer to
CC_MAX
for further details on FMB guidelines.
Min Typ
stable
CC
stable
®
for more information.
level that exceeds the V
CC
loadline Refer to Figure 2-10
CC
Figure 2-9 for further details on the average processor
Electrical Specifications
Notes
Max Unit
1,17
8.0 A 15
7.0
50 A 6,14
75 A 6,14
75 A 6,14
110 A 6,14
580 mA 16
200 µA 7
260 mA 12
60 A
90 A
90 A
130 A
associated with any
CC_MAX
for details. The processor is
. This specification is
CC
Document Number: 318080-002