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3.
Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
4.
These specifications are based pre-silicon estimates and simulations. These specifications will be updated
with characterized data from silicon measurements in a future release of this document.
5.
Power specifications are defined at all VIDs found in
7200 Series may be shipped under multiple VIDs for each frequency.
6.
FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
Table 6-8.
Dual-Core Intel® Xeon® Processor 7200 Series Thermal Profile
Power (W)
6.1.2
Thermal Metrology
The minimum and maximum case temperatures (T
through
Table
integrated heat spreader (IHS).
temperature measurements should be made. For detailed guidelines on temperature
measurement methodology, refer to the Dual-Core Intel® Xeon® Processor 7200
Series and Quad-Core Intel® Xeon® Processor 7300 Series Thermal / Mechanical
Design Guide.
102
T
CASE_MAX
0
45.0
10
47.4
20
49.8
30
52.1
40
54.5
50
56.9
60
59.3
70
61.7
80
64.0
6-8, and are measured at the geometric top center of the processor
Figure 6-5
Table
2-3. The Dual-Core Intel® Xeon® Processor
(° C)
) are specified in
CASE
illustrates the location where T
Thermal Specifications
.
CASE
Table
6-2,
CASE
Document Number: 318080-002
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