Fill Areas Under Bgas - Intel Pentium M Processor Design Manual

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Intel Pentium M Processor and Intel E7501 Chipset Platform
High-Speed Design Concerns
12.9.2

Fill Areas Under BGAs

To minimize impedance for ground and power pins, ensure power and ground fills are placed
directly under the BGAs. Figure 164 shows the proper method for fills under the MCH. The
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same methodology should be applied to the processor, Intel P64H2 and Intel ICH3-S.
Figure 164. MCH Fill
2.5V Fill
1.25V Fill
1.2V Fill
Design Guide
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