Connection Of Equipotential Bonding - Siemens SIMATIC HMI Industrial Thin Client ITC1200 Operating Instructions Manual

3.4.2

Connection of equipotential bonding

Differences in electrical potential
Differences in electrical potential can develop between spatially separated plant components.
Such electrical potential differences can lead to high equalizing currents over the data cables
and therefore to the destruction of their interfaces. Equalizing currents can develop if the
cable shielding is terminated at both ends and grounded to different plant parts.
Differences in potential may develop when a system is connected to different mains supplies.
General requirements for equipotential bonding
Differences in potential must be reduced by means of equipotential bonding in order to
ensure trouble-free operation of the relevant components of the electronic system. The
following must therefore be observed when installing the equipotential bonding circuit:
● The effectiveness of equipotential bonding increases as the impedance of the
● If two plant parts are interconnected by means of shielded data cables and their shielding
● The cross-section of an equipotential bonding conductor must be capable of handling the
● Use equipotential bonding conductors made of copper or galvanized steel. Establish a
● Use a suitable cable clip to clamp the shield of the data cable flush to the equipotential
● Route the equipotential bonding conductor and data cables in parallel and with minimum
Industrial Thin Client ITC1200, ITC1500, ITC1900, ITC2200
Operating Instructions, 04/2013, A5E03474888-02
equipotential bonding conductor decreases or as its cross-section increases.
is bonded at both ends to the grounding/protective conductor, the impedance of the
additionally installed equipotential bonding cable must not exceed 10% of the shielding
impedance.
maximum equalizing current.
large surface contact between the equipotential bonding conductors and the
grounding/protective conductor and protect these from corrosion.
bonding rail. Keep the length of cable between the device and the equipotential bonding
rail as short as possible.
clearance between these.
Installing and connecting the device
3.4 Connecting the device
27