Processors
11.6
Applying thermal paste
Field Replaceable Unit
(FRU)
Tools: tool-less
I
– For the Japanese market, the service engineer must follow the
instruction provided separately.
– If the processor upgrade or replacement kit contains a new processor
heat sink, a thin layer of thermal compound has already been pre-
applied to its lower surface. In this case, please proceed with section
"Installing processor heat sinks" on page
Figure 188: Thermal paste syringe
One thermal compound syringe (A3C40142460 / 34035576) contains thermal
paste for three processors.
272
Upgrade and Maintenance Manual
Hardware: 5 minutes
268.
TX150 S8 / TX200 S7