Figure 151. Bottom Layer Power Delivery Shape (Vcc_Cpu) - Intel Pentium 4 Design Manual

Intel® Pentium® 4 Processor in the 478-Pin Package Processor Power Distribution Guidelines

Figure 151. Bottom Layer Power Delivery Shape (VCC_CPU)

The high frequency decoupling capacitors should be placed with alternating VCC_CPU and VSS
to provide a better path for power delivery through the capacitor field. An example of this
placement is shown in Figure 152.
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850 Chipset Family Platform Design Guide
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