Intel Pentium 4 Design Manual page 6

Introduction
9.1.3
9.1.4
9.2 Communication and Networking Riser (CNR).................................................... 139
9.2.1
9.3 Intel
9.3.1
9.3.2
9.4 USB Guidelines .................................................................................................. 148
9.5 IOAPIC Design Recommendations .................................................................... 149
9.6 SMBus/SMLink Interface .................................................................................... 150
9.6.1
9.7 PCI...................................................................................................................... 153
9.7.1
9.8 RTC .................................................................................................................... 157
9.8.1
9.8.2
9.8.3
9.8.4
9.8.5
9.8.6
9.8.7
9.8.8
9.8.9
9.9 LAN Layout Guidelines ....................................................................................... 162
9.9.1
9.9.2
9.9.3
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Primary IDE Connector Requirements................................................ 137
Secondary IDE Connector Requirements ........................................... 138
CNR Placement .................................................................................. 139
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AC'97 ........................................................................................................ 140
AC'97 Audio Codec Detect Circuit and Configuration Options ........... 144
Valid Codec Configurations................................................................. 148
SMBus Architecture and Design Considerations ................................ 151
9.6.1.1 SMBus Design Considerations .......................................... 151
9.6.1.2 General Design Issues / Notes.......................................... 151
9.6.1.3 The Unified VCC_ Suspend Architecture .......................... 152
9.6.1.4 The Unified VCC_Core Architecture.................................. 152
9.6.1.5 Mixed Architecture ............................................................. 153
PCI Routing - Four-Layer Motherboard.............................................. 154
RTC Crystal......................................................................................... 157
External Capacitors............................................................................. 158
RTC Layout Considerations ................................................................ 158
RTC External Battery Connection ....................................................... 158
RTC External RTCRST Circuit............................................................ 159
RTC Routing Guidelines ..................................................................... 160
VBIAS DC Voltage and Noise Measurements .................................... 160
Power-Well Isolation Control............................................................... 161
Power Supply PS_ON Consideration.................................................. 162
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Intel ICH2 - LAN Interconnect Guidelines......................................... 164
9.9.1.1 Bus Topologies .................................................................. 164
9.9.1.2 Point-to-Point Interconnect ................................................ 164
9.9.1.3 LOM/CNR Interconnect ..................................................... 165
9.9.1.4 Signal Routing and Layout................................................. 166
9.9.1.5 Crosstalk Considerations................................................... 166
9.9.1.6 Impedances ....................................................................... 166
9.9.1.7 Line Termination................................................................ 167
General LAN Routing Guidelines and Considerations ........................ 167
9.9.2.1 General Trace Routing Considerations ............................. 167
9.9.2.1.1
9.9.2.1.2
9.9.2.2 Power and Ground Connections........................................ 169
9.9.2.2.1
9.9.2.3 Common Physical Layout Issues....................................... 170
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Intel 82562EH Home/PNA* Guidelines ............................................. 172
9.9.3.1 Power and Ground Connections........................................ 172
9.9.3.2 Guidelines for Intel
9.9.3.3 Crystals and Oscillators ..................................................... 172
9.9.3.4 Phoneline HPNA Termination............................................ 173
9.9.3.5 Critical Dimensions ............................................................ 174
9.9.3.5.1
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Intel Pentium 4 Processor / Intel
Trace Geometry and Length.............................. 168
Signal Isolation .................................................. 168
General Power and Ground Plane
Considerations................................................... 169
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82562EH Component Placement ..... 172
Distance from Magnetics Module to Line RJ11 . 174
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850 Chipset Family Platform Design Guide
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