DataCard SR200 Service Manual page 13

2.3 Check details after mounting separately sold parts
Item
1 Reform H unit
2 IC Contact unit
3 MG Unit
4 Running after mounting the
separately sold parts
(For all separately sold parts)
Item Item
5 Safety test (for Withstand
all separately voltage test
sold parts)
Insulation re-
sistance test
Grounding
continuity test
1-12 (No.HD007<Rev.001>)
Check details
The warpage of the printed card should be within the specs (1.5
mm).
Check the IC contact position mark using a blank card and a
contact label.
• Service mode > Offline Test > Test the IC (Contact).
• If the position is out of specs, Maintenance > OffsetContact to
adjust the position. (See 2.3.1 IC contact position adjustment)
The card written with an application should be read by the read-
er.
(Check in the USB and Ethernet connections)
Service mode > Offline Test > test the MG.
• The test should be finished normally.
The card written with an application should be read by the read-
er.
• There is no adjustment for an MG unit after mounting because
MG units are shipped after being position adjusted. Check for
normal operation only.
Test for normal printing on about 10 cards
• Service mode > Offline Test > print
Conditions & specs
Timer Leak current
2 to 3 sec. 10mA
Test voltage
DC 500V
Timer Test current
3 to 4 sec. AC25A
Test voltage
AC1600±50V
Insulation resistance value
100MΩ and over
Spec value
0.1Ω or under
(Without power cord)
A
C
B
Required tools
Blank card
Blank card, Contact label
Contact IC card
Contact IC reader
MG card
MG reader
Evaluation card
Test point
(With the POWER SW: ON)
GND C on the AC inlet in the
drawing below
|
Bipolar B on the power cord in
the drawing below
(With the POWER SW: ON)
Screw A on the top left of the
rear panel in the drawing below
|
GND C on the AC inlet in the
drawing below