Intel Xeon 3500 Series Datasheet page 4

7 Features ..................................................................................................................93
7.1 Power-On Configuration (POC).............................................................................93
7.2 Clock Control and Low Power States .....................................................................93
7.2.1 Thread and Core Power State Descriptions .................................................94
7.2.2 Package Power State Descriptions .............................................................95
7.3 Sleep States .....................................................................................................96
7.4 ACPI P-States (Intel
7.5 Enhanced Intel SpeedStep
8 Boxed Processor Specifications................................................................................99
8.1 Introduction ......................................................................................................99
8.2 Mechanical Specifications .................................................................................. 100
8.2.1 Boxed Processor Cooling Solution Dimensions........................................... 100
8.2.2 Boxed Processor Fan Heatsink Weight ..................................................... 102
8.2.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly ... 102
8.3 Electrical Requirements .................................................................................... 102
8.3.1 Fan Heatsink Power Supply .................................................................... 102
8.4 Thermal Specifications...................................................................................... 103
8.4.1 Boxed Processor Cooling Requirements.................................................... 103
8.4.2 Variable Speed Fan ............................................................................... 105
Figures
1-1 High-Level View of Processor Interfaces ................................................................. 9
2-1 Active ODT for a Differential Link Example ............................................................13
2-2 Input Device Hysteresis ......................................................................................21
2-3 VCC Static and Transient Tolerance Load Lines ......................................................25
2-4 VTT Static and Transient Tolerance Load Line ........................................................27
2-5 VCC Overshoot Example Waveform ......................................................................30
3-1 Processor Package Assembly Sketch.....................................................................31
3-2 Processor Package Drawing (Sheet 1 of 2) ............................................................32
3-3 Processor Package Drawing (Sheet 2 of 2) ............................................................33
3-4 Processor Top-Side Markings ...............................................................................35
3-5 Processor Land Coordinates and Quadrants (Bottom View) ......................................36
6-1 Processor Thermal Profile....................................................................................81
6-2 Thermal Test Vehicle (TTV) Case Temperature (TCASE) Measurement Location ..........83
6-3 Frequency and Voltage Ordering ..........................................................................86
7-1 Power States.....................................................................................................94
8-1 Mechanical Representation of the Boxed Processor .................................................99
8-2 Space Requirements for the Boxed Processor (side view) ...................................... 100
8-3 Space Requirements for the Boxed Processor (top view) ....................................... 101
8-4 Space Requirements for the Boxed Processor (overall view) .................................. 101
8-5 Boxed Processor Fan Heatsink Power Cable Connector Description.......................... 102
8-6 Baseboard Power Header Placement Relative to Processor Socket........................... 103
8-7 Boxed Processor Fan Heatsink Airspace Keepout Requirements (top view) ............... 104
8-8 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side view) .............. 104
8-9 Boxed Processor Fan Heatsink Set Points ............................................................ 105
4
®
Turbo Boost Technology) .....................................................96
®
Technology ...............................................................97
Intel® Xeon® Processor 3500 Series Datasheet, Volume 1