Intel Xeon Datasheet page 11

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Demand-Based Switching (DBS) with Enhanced Intel SpeedStep® Technology —
Demand-Based Switching (DBS) with Enhanced Intel SpeedStep® Technology is the next
generation implementation of Geyserville technology which extends power management
capabilities of servers and workstations.
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Enterprise Voltage Regulator Down (EVRD) — DC-DC converter integrated onto the
system board that provide the correct voltage and current for the processor based on the logic
state of the VID bits.
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Flip Chip Micro Pin Grid Array (FC-mPGA4) Package — The processor package is a Flip
Chip Micro Pin Grid Array (FC-mPGA4), consisting of a processor core mounted on a pinned
substrate with an integrated heat spreader (IHS). This package technology employs a 1.27 mm
[0.05 in.] pitch for the processor pins.
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Front Side Bus (FSB) — The electrical interface that connects the processor to the chipset.
Also referred to as the processor system bus or the system bus. All memory and I/O
transactions as well as interrupt messages pass between the processor and the chipset over the
FSB.
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Functional Operation — Refers to the normal operating conditions in which all processor
specifications, including DC, AC, system bus, signal quality, mechanical and thermal are
satisfied.
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Integrated Heat Spreader (IHS) — A component of the processor package used to enhance
the thermal performance of the package. Component thermal solutions interface with the
processor at the IHS surface.
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mPGA604 Socket — The Intel® Xeon™ processor with 800 MHz system bus mates with the
baseboard through this surface mount, 604-pin, zero insertion force (ZIF) socket. See the
mPGA604 Socket Design Guidelines for details regarding this socket.
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Processor Core — The processor's execution engine.
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Storage Conditions — Refers to a non-operational state. The processor may be installed in a
platform, in a tray, or loose. Processors may be sealed in packaging or exposed to free air.
Under these conditions, processor pins should not be connected to any supply voltages, have
any I/Os biased or receive any clocks.
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Symmetric Agent — A symmetric agent is a processor which shares the same I/O subsystem
and memory array, and runs the same operating system as another processor in a system.
Systems using symmetric agents are known as Symmetric Multiprocessor (SMP) systems.
Intel® Xeon™ processor with 800 MHz system bus should only be used in SMP systems
which have two or fewer agents.
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Thermal Design Power — Processor/chipset thermal solution should be designed to this
target. It is the highest expected sustainable power while running known power-intensive real
applications. TDP is not the maximum power that the processor/chipset can dissipate.
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Voltage Regulator Module (VRM) — DC-DC converter built onto a module that interfaces
with an appropriate card edge socket that supplies the correct voltage and current to the
processor.
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V
CC
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V — The processor ground.
SS
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V
TT
Datasheet
— The processor core power supply.
— The system bus termination voltage.
Intel® Xeon™ Processor with 800 MHz System Bus
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