Table Of Contents - Intel Xeon 5500 Series Design Manual

Contents
1 Introduction .............................................................................................................. 9
1.1 References ....................................................................................................... 10
1.2 Definition of Terms ............................................................................................ 10
2 LGA1366 Socket ...................................................................................................... 13
2.1 Board Layout .................................................................................................... 15
2.2 Attachment to Motherboard ................................................................................ 16
2.3 Socket Components........................................................................................... 16
2.3.1 Socket Body Housing .............................................................................. 16
2.3.2 Solder Balls ........................................................................................... 16
2.3.3 Contacts ............................................................................................... 17
2.3.4 Pick and Place Cover............................................................................... 17
2.4 Package Installation / Removal ........................................................................... 18
2.4.1 Socket Standoffs and Package Seating Plane.............................................. 18
2.5 Durability ......................................................................................................... 19
2.6 Markings .......................................................................................................... 19
2.7 Component Insertion Forces ............................................................................... 19
2.8 Socket Size ...................................................................................................... 19
2.9 LGA1366 Socket NCTF Solder Joints..................................................................... 20
3 Independent Loading Mechanism (ILM)................................................................... 21
3.1 Design Concept................................................................................................. 21
3.1.1 ILM Cover Assembly Design Overview ....................................................... 21
3.1.2 ILM Back Plate Design Overview ............................................................... 22
3.2 Assembly of ILM to a Motherboard....................................................................... 23
4 LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications . 27
4.1 Component Mass............................................................................................... 27
4.2 Package/Socket Stackup Height .......................................................................... 27
4.3 Socket Maximum Temperature ............................................................................ 27
4.4 Loading Specifications........................................................................................ 28
4.5 Electrical Requirements ...................................................................................... 28
4.6 Environmental Requirements .............................................................................. 29
5 Thermal Solutions ................................................................................................... 31
5.1 Performance Targets.......................................................................................... 31
5.1.1 25.5 mm Tall Heatsink ............................................................................ 33
5.2 Heat Pipe Considerations .................................................................................... 34
5.3 Assembly ......................................................................................................... 35
5.3.1 Thermal Interface Material (TIM) .............................................................. 36
5.4 Structural Considerations ................................................................................... 36
5.5 Thermal Design................................................................................................. 36
5.5.1 Thermal Characterization Parameter ......................................................... 36
5.5.2 Dual Thermal Profile ............................................................................... 37
5.6 Thermal Features .............................................................................................. 38
5.6.1 Fan Speed Control .................................................................................. 39
5.6.2 PECI Averaging and Catastrophic Thermal Management............................... 40
5.6.3 Intel® Turbo Boost Technology ................................................................ 40
5.7 Thermal Guidance ............................................................................................. 40
5.7.1 Thermal Excursion Power for 95 W Processor ............................................. 40
5.7.2 Thermal Excursion Power for 80 W Processor ............................................. 41
5.7.3 Absolute Processor Temperature .............................................................. 41
Thermal/Mechanical Design Guide 3