Intel Xeon 5500 Series Design Manual page 4

6 Quality and Reliability Requirements .......................................................................43
6.1 Test Conditions .................................................................................................43
6.2 Intel Reference Component Validation ..................................................................45
6.2.1 Board Functional Test Sequence ...............................................................45
6.2.2 Post-Test Pass Criteria.............................................................................45
6.2.3 Recommended BIOS/Processor/Memory Test Procedures .............................46
6.3 Material and Recycling Requirements....................................................................46
A Component Suppliers ...............................................................................................47
A.1 Intel Enabled Supplier Information .......................................................................47
A.1.1 Intel Reference Thermal Solution ..............................................................47
A.1.2 Intel Collaboration Thermal Solution..........................................................47
A.1.3 Alternative Thermal Solution ....................................................................48
A.1.4 Socket and ILM Components ....................................................................49
B Mechanical Drawings ...............................................................................................51
C Socket Mechanical Drawings ....................................................................................79
D Heatsink Load Metrology..........................................................................................85
E Embedded Thermal Solutions ...................................................................................87
E.1 Performance Targets ..........................................................................................87
E.2 Thermal Design Guidelines ..................................................................................88
E.2.1 NEBS Thermal Profile ..............................................................................88
E.2.2 Custom Heat Sinks For UP ATCA ...............................................................89
E.3 Mechanical Drawings and Supplier Information ......................................................92
F Processor Installation Tool ......................................................................................97
Figures
1-1 Intel® Xeon® 5500 Platform Socket Stack ................................................................... 9
2-1 LGA1366 Socket with Pick and Place Cover Removed ....................................................13
2-2 LGA1366 Socket Contact Numbering (Top View of Socket) .............................................14
2-3 LGA1366 Socket Land Pattern (Top View of Board) .......................................................15
2-4 Attachment to Motherboard .......................................................................................16
2-5 Pick and Place Cover .................................................................................................17
2-6 Package Installation / Removal Features......................................................................18
2-7 LGA1366 NCTF Solder Joints ......................................................................................20
3-1 ILM Cover Assembly .................................................................................................22
3-2 Back Plate ...............................................................................................................23
3-3 ILM Assembly ..........................................................................................................24
3-4 Pin1 and ILM Lever ...................................................................................................25
4-1 Flow Chart of Knowledge-Based Reliability Evaluation Methodology .................................30
5-1 1U Heatsink Performance Curves ................................................................................32
5-2 TTV Die Size and Orientation......................................................................................34
5-3 1U Reference Heatsink Assembly ................................................................................35
5-4 Processor Thermal Characterization Parameter Relationships ..........................................37
5-5 Dual Thermal Profile .................................................................................................38
6-1 Example Thermal Cycle - Actual profile will vary ...........................................................45
B-1 Board Keepin / Keepout Zones (Sheet 1 of 4)...............................................................52
B-2 Board Keepin / Keepout Zones (Sheet 2 of 4)...............................................................53
B-3 Board Keepin / Keepout Zones (Sheet 3 of 4)...............................................................54
B-4 Board Keepin / Keepout Zones (Sheet 4 of 4)...............................................................55
B-5 1U Reference Heatsink Assembly (Sheet 1 of 2) ...........................................................56
B-6 1U Reference Heatsink Assembly (Sheet 2 of 2) ...........................................................57
4 Thermal/Mechanical Design Guide