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Table 6-1.
Heatsink Test Conditions and Qualification Criteria (Sheet 2 of 2)
Assessment
8) Thermal
Using 1U heatsink and 1U airflow from
Performance
Table
1) TTV @ 95W (Profile B), Note 1.
Using 2U heatsink and 2U airflow from
Table
2) TTV @ 95W (Profile A), Note 1.
3) TTV @ 80W.
4) TTV @ 60W.
Using Tower heatsink and Tower airflow
from
5) TTV @ 130W, Note 1.
6) TTV @ 95W (Profile A).
7) TTV @ 80W.
8) TTV @ 60W.
9) Thermal Cycling
Required for heatpipe designs.
Temperature range at pipe in heatsink
assembly: -25C to +100C for 500 cycles.
Cycle time is 30 minutes per full cycle,
divided into half cycle in hot zone and half
in cold zone, with minimum 1min soak at
each temperature extreme for each cycle.
See
10) Heat Pipe Burst
Continuously raise oven temperature and
record the burst/leak temperatures of fully
assembled heatsinks
11) Heatsink Mass
Design Target < 500 g
12) Heatsink Load
Design Targets:
0.062" board = 38.7 ± 7.2 lbf (Fmin =
31.5 lbf).
0.100" board = 51.4 ± 7.9 lbf (Fmax =
59.3 lbf).
44
Test Condition
5-1:
5-1:
Table
5-1:
Figure 6-1
for example profile.
Quality and Reliability Requirements
Qualification Criteria
As verified in wind tunnel:
1) mean Ψ
+ 3s + offset not to exceed
CA
Table 5-1
value for 95W in 1U.
2-4) mean Ψ
+ 3s + offset not to exceed
CA
Table 5-1
value for 2U.
5-8) mean Ψ
+ 3s + offset not to exceed
CA
Table 5-1
value for Tower.
As verified in wind tunnel:
• Mean Ψ
+ 3s + offset not to exceed
CA
value in
Table
5-1.
• Pressure drop not to exceed value in
Table
5-1.
No failures at minimum of 300C @ 20
minutes
All samples < 550 g
No samples < 30 lbf on 0.062" board.
5 highest load samples (from 0.062" test)
< 60 lbf on 0.100" board
Thermal/Mechanical Design Guide
Min
Sample
Size
5 heatsinks
X 8 tests by
supplier.
Note 1: 30
heatsinks X
3 tests by
Intel.
15
32 pipes
30
30
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