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Pentium 4 631
Intel Pentium 4 631 Manuals
Manuals and User Guides for Intel Pentium 4 631. We have
1
Intel Pentium 4 631 manual available for free PDF download: Datasheet
Intel Pentium 4 631 Datasheet (106 pages)
Pentium 4 Processor 6x1 Sequence, On 65 nm Process in the 775-land LGA Package supporting Hyper-Threading Technology and 64 arhitecture
Brand:
Intel
| Category:
Computer Hardware
| Size: 4.29 MB
Table of Contents
Table of Contents
3
Revision History
7
Introduction
9
Terminology
10
Processor Packaging Terminology
10
References
11
Electrical Specifications
13
Power and Ground Lands
13
Decoupling Guidelines
13
VCC
13
CC Decoupling
13
TT Decoupling
13
FSB Decoupling
14
Voltage Identification
14
Tables
15
Voltage Identification Definition
15
Reserved, Unused, and TESTHI Signals
16
Voltage and Current Specification
17
Absolute Maximum and Minimum Ratings
17
DC Voltage and Current Specification
18
And for 775_VR_CONFIG_06 Processors
20
VCC Overshoot
21
VCC
21
And for 775_VR_CONFIG_06 Processors
21
Die Voltage Validation
22
Signaling Specifications
22
FSB Signal Groups
23
Figures
21
Signal Characteristics
24
Signal Reference Voltages
24
GTL+ Asynchronous Signals
25
Processor DC Specifications
25
GTL+ Asynchronous Signal Group DC Specifications
25
GTL+ Signal Group DC Specifications
25
PWRGOOD and TAP Signal Group DC Specifications
26
BOOTSELECT DC Specifications
27
GTL+ Front Side Bus Specifications
28
BSEL[2:0] and VID[5:0] DC Specifications
27
VTTPWRGD DC Specifications
27
GTL+ Bus Voltage Definitions
28
Clock Specifications
29
Front Side Bus Clock (BCLK[1:0]) and Processor Clocking
29
Core Frequency to FSB Multiplier Configuration
29
FSB Frequency Select Signals (BSEL[2:0])
30
Phase Lock Loop (PLL) and Filter
30
BSEL[2:0] Frequency Table for BCLK[1:0]
30
Phase Lock Loop (PLL) Filter Requirements
31
BCLK[1:0] Specifications
32
Front Side Bus Differential BCLK Specifications
32
Package Mechanical Specifications
33
Package Mechanical Drawing
33
Processor Package Assembly Sketch
33
Processor Package Drawing Sheet 1 of 3
34
Processor Package Drawing Sheet 2 of 3
35
Processor Package Drawing Sheet 3 of 3
36
Processor Component Keep-Out Zones
37
Package Loading Specifications
37
Package Handling Guidelines
37
Processor Loading Specifications
37
Package Insertion Specifications
38
Processor Mass Specification
38
Processor Materials
38
Processor Markings
38
Processor Top-Side Markings Example
38
Processor Land Coordinates
39
Processor Land Coordinates and Quadrants (Top View)
39
Land Listing and Signal Descriptions
41
Processor Land Assignments
41
Land-Out Diagram (Top View - Left Side)
42
Land-Out Diagram (Top View - Right Side)
43
Alphabetical Land Assignments
44
Numerical Land Assignment
54
Alphabetical Signals Reference
64
VCC
72
Signal Description (Sheet 1 of 9)
72
Thermal Specifications and Design Considerations
75
Processor Thermal Specifications
75
Thermal Specifications
75
Processor Thermal Specifications for 775_VR_CONFIG_05A Processors
76
Processor Thermal Specifications for 775_VR_CONFIG_06 Processors
76
Thermal Profile for 775_VR_CONFIG_05A Processors
77
Thermal Profile for 775_VR_CONFIG_06 Processors
78
Thermal Metrology
79
Processor Thermal Features
79
Thermal Monitor
79
Thermal Monitor 2
80
On-Demand Mode
81
Thermal Monitor 2 Frequency and Voltage Ordering
81
PROCHOT# Signal
82
THERMTRIP# Signal
82
TCONTROL and Fan Speed Reduction
82
Thermal Diode
82
Thermal "Diode" Parameters Using Diode Model
83
Thermal "Diode" Parameters Using Transistor Model
83
Thermal "Diode" N
84
Thermal Diode Interface
84
Features
85
Power-On Configuration Options
85
Clock Control and Low Power States
85
Power-On Configuration Option Signals
85
Normal State
86
HALT and Enhanced HALT Powerdown States
86
HALT Powerdown State
86
Processor Low Power State Machine
86
Enhanced HALT Powerdown State
87
Stop Grant State
87
Enhanced HALT Snoop or HALT Snoop State, Stop Grant Snoop State
88
HALT Snoop State, Stop Grant Snoop State
88
Enhanced HALT Snoop State
88
Boxed Processor Specifications
89
Mechanical Specifications
89
Boxed Processor Cooling Solution Dimensions
89
Mechanical Representation of the Boxed Processor
89
Space Requirements for the Boxed Processor (Side View; Applies to All Four Side Views)
90
Boxed Processor Fan Heatsink Weight
91
Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly
91
Electrical Requirements
91
Fan Heatsink Power Supply
91
Space Requirements for the Boxed Processor (Overall View)
91
Boxed Processor Fan Heatsink Power Cable Connector Description
92
Fan Heatsink Power and Signal Specifications
92
Thermal Specifications
93
Boxed Processor Cooling Requirements
93
Baseboard Power Header Placement Relative to Processor Socket
93
Boxed Processor Fan Heatsink Airspace Keep-Out Requirements
94
Boxed Processor Fan Heatsink Airspace Keep-Out Requirements (Side 2 View)
94
Balanced Technology Extended (BTX) Boxed Processor Specifications
95
Mechanical Representation of the Boxed Processor with a Type I TMA
95
Mechanical Specifications
96
Balanced Technology Extended (BTX) Type I and Type II Boxed Processor Cooling Solution Dimensions
96
Mechanical Representation of the Boxed Processor with a Type II TMA
96
Requirements for the Balanced Technology Extended (BTX) Type I Keep-Out Volumes
97
Boxed Processor Thermal Module Assembly Weight
98
Boxed Processor Support and Retention Module (SRM)
98
Requirements for the Balanced Technology Extended (BTX) Type II Keep-Out Volume
98
Electrical Requirements
99
Thermal Module Assembly Power Supply
99
Assembly Stack Including the Support and Retention Module
99
Boxed Processor TMA Power Cable Connector Description
100
TMA Power and Signal Specifications
100
Thermal Specifications
101
Boxed Processor Cooling Requirements
101
Balanced Technology Extended (BTX) Mainboard Power Header Placement
101
Variable Speed Fan
102
Boxed Processor TMA Set Points
102
TMA Set Points for 3-Wire Operation of BTX Type I and Type II Boxed Processors
103
Debug Tools Specifications
105
Logic Analyzer Interface (LAI)
105
Mechanical Considerations
105
Electrical Considerations
105
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