Intel HH80552PG0962M - Pentium 4 3.4 GHz Processor Datasheet page 4

Pentium 4 processor 6x1 sequence, on 65 nm process in the 775-land lga package supporting hyper-threading technology and 64 arhitecture
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5.2.5
THERMTRIP# Signal ................................................................................82
5.2.6
5.2.7
Thermal Diode........................................................................................82
6
..............................................................................................................85
6.1
Power-On Configuration Options ..........................................................................85
6.2
Clock Control and Low Power States .....................................................................85
6.2.1
Normal State .........................................................................................86
6.2.2
HALT and Enhanced HALT Powerdown States..............................................86
6.2.2.1
6.2.2.2
6.2.3
Stop Grant State ....................................................................................87
6.2.4
Stop Grant Snoop State...........................................................................88
6.2.4.1
6.2.4.2
7
7.1
Mechanical Specifications ....................................................................................89
7.1.1
Boxed Processor Cooling Solution Dimensions.............................................89
7.1.2
Boxed Processor Fan Heatsink Weight .......................................................91
7.1.3
Attach Clip Assembly...............................................................................91
7.2
Electrical Requirements ......................................................................................91
7.2.1
Fan Heatsink Power Supply ......................................................................91
7.3
Thermal Specifications........................................................................................93
7.3.1
Boxed Processor Cooling Requirements......................................................93
8
8.1
Mechanical Specifications ....................................................................................96
8.1.1
Type II Boxed Processor Cooling Solution Dimensions..................................96
8.1.2
Boxed Processor Thermal Module Assembly Weight .....................................98
8.1.3
Boxed Processor Support and Retention Module (SRM) ................................98
8.2
Electrical Requirements ......................................................................................99
8.2.1
Thermal Module Assembly Power Supply ....................................................99
8.3
Thermal Specifications...................................................................................... 101
8.3.1
Boxed Processor Cooling Requirements.................................................... 101
8.3.2
Variable Speed Fan ............................................................................... 102
9
9.1
Logic Analyzer Interface (LAI) ........................................................................... 105
9.1.1
Mechanical Considerations ..................................................................... 105
9.1.2
Electrical Considerations ........................................................................ 105
4
and Fan Speed Reduction ...........................................................82
HALT Powerdown State ..............................................................86
Enhanced HALT Powerdown State................................................87
HALT Snoop State, Stop Grant Snoop State ..................................88
Enhanced HALT Snoop State .......................................................88
........................................................................89
.............................................................................. 105
.....95
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Pentium 4 631Pentium 4 641Pentium 4 651Pentium 4 661

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