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Electrical Specifications
Table 4.
Voltage and Current Specification
Symbol
VTT_OUT_LEFT
DC Current that may be drawn from
and
VTT_OUT_LEFT and VTT_OUT_RIGHT per
VTT_OUT_RIGHT
pin
I
CC
I
Steady-state FSB termination current
TT
I
Power-up FSB termination current
TT_P
-
OWER
UP
I
I
for PLL lands
CC_VCCA
CC
I
I
for I/O PLL land
CC_VCCIOPLL
CC
I
I
for GTLREF
CC_GTLREF
CC
NOTES:
1. Unless otherwise noted, all specifications in this table are based on estimates and simulations or empirical data. These
specifications will be updated with characterized data from silicon measurements at a later date.
2. Adherence to the voltage specifications for the processor are required to ensure reliable processor operation.
3. Each processor is programmed with a maximum valid voltage identification value (VID) that is set at manufacturing and can
not be altered. Individual maximum VID values are calibrated during manufacturing such that two processors at the same
frequency may have different settings within the VID range. Note that this differs from the VID employed by the processor
during a power management event (Thermal Monitor 2, Enhanced Intel SpeedStep technology, or Enhanced HALT State).
These voltages are targets only. A variable voltage source should exist on systems in the event that a different
4.
voltage is required. See
5. The voltage specification requirements are measured across VCC_SENSE and VSS_SENSE lands at the socket with a 100 MHz
bandwidth oscilloscope, 1.5 pF maximum probe capacitance, and 1 MΩ minimum impedance. The maximum length of ground
wire on the probe should be less than 5 mm. Ensure external noise from the system is not coupled into the oscilloscope probe.
Refer to
and
6.
Table 5
Figure 1
processor should not be subjected to any V
current.
7. I
is specified at V
CC_MAX
CC_MAX
8. The current specified is also for AutoHALT State.
9. I
Stop-Grant is specified at V
CC
10.I
and I
SGNT
ENHANCED_AUTO_HALT
11.These parameters are based on design characterization and are not tested.
12.The maximum instantaneous current the processor will draw while the thermal control circuit is active (as indicated by the
assertion of PROCHOT#) is the same as the maximum I
13.V
must be provided via a separate voltage source and not be connected to V
TT
14.Baseboard bandwidth is limited to 20 MHz.
This is maximum total current drawn from V
15.
the current coming from R
For Desktop and Transportable LGA775 Socket
16.This is a steady-state I
current specification, which is applicable when both V
TT
17.This is a power-up peak current specification that is applicable when V
Datasheet
Parameter
and
for more information.
Section 2.3
Table 2
for the minimum, typical, and maximum V
and I
CC
.
.
CC_MAX
are specified at V
and TC = 50 °C.
CC_TYP
CC
plane by only the processor. This specification does not include
TT
(through the signal line). Refer to the
TT
to determine the total I
Min
Typ
—
—
—
—
—
—
—
—
—
—
—
—
allowed for a given current. The
CC
combination wherein V
CC
for the processor.
. This specification is measured at the land.
CC
Voltage Regulator-Down (VRD) 10.1 Design Guide
drawn by the system.
TT
and V
TT
CC
is high and V
TT
CC
Max
Unit
Notes
580
mA
15, 16
3.5
A
15, 17
4.5
A
35
mA
26
mA
200
µA
exceeds V
for a given
CC
CC_MAX
are high.
is low.
1, 2
19
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