Boxed Processor Thermal Module Assembly Weight; Boxed Processor Support And Retention Module (Srm); Requirements For The Balanced Technology Extended (Btx) Type Ii Keep-Out Volume - Intel HH80552PG0962M - Pentium 4 3.4 GHz Processor Datasheet
Pentium 4 processor 6x1 sequence, on 65 nm process in the 775-land lga package supporting hyper-threading technology and 64 arhitecture
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Figure 28.
Requirements for the Balanced Technology Extended (BTX) Type II Keep-out
Volume
NOTE: Diagram does not show the attached hardware for the clip design and is provided only as a
mechanical representation.
8.1.2
Boxed Processor Thermal Module Assembly Weight
The boxed processor thermal module assembly for Type I BTX will not weigh more than
1200 grams. The boxed processor thermal module assembly for Type II BTX will not
weigh more than 1200 grams. See
and Mechanical Design Guidelines (see
and thermal module assembly requirements.
8.1.3
Boxed Processor Support and Retention Module (SRM)
The boxed processor TMA requires an SRM assembly provided by the chassis
manufacturer. The SRM provides the attach points for the TMA and provides structural
support for the board by distributing the shock and vibration loads to the chassis base
pan. The boxed processor TMA will ship with the heatsink attach clip assembly, duct
and screws for attachment. The SRM must be supplied by the chassis hardware vendor.
See the Support and Retention Module (SRM) External Design Requirements
98
Balanced Technology Extended (BTX) Boxed Processor Specifications
Chapter 5
and the appropriate processor Thermal
Section
1.2) for details on the processor weight
Datasheet
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