Texas Instruments ADS1282V2EVM-PDK User Manual page 27

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5.3 Bill of Materials (BOM)
Designator Quantity
!PCB1 1
C1, C3, C16, C19,
7
C20, C22, C24
C2, C4, C8, C12,
8
C14, C17, C21, C28
C5, C7 2
C6, C18, C23, C25 4
C9, C10, C11 3
C13 1
C15, C27, C30, C31,
5
C32
C26 1
C29 1
D1 1
H1, H2 2
H3, H4, H5, H6 4
H7, H8 2
J3, J5, JP1, JP3 4
J7 1
J8 1
JP2 1
SBAU431 – JULY 2024
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Table 5-1. Bill of Materials
Value Description
Printed Circuit Board
10uF CAP, CERM, 10µF, 25V,+/- 10%, X5R, 0805
CAP, 1uF, 25V, ±10%, X7R, 0603
CAP, CERM, 1000pF, 50V, +/- 5%, C0G/NP0,
1000pF
0603
CAP, CERM, 0.01µF, 25V,+/- 1%, C0G/NP0,
0.01uF
0603
CAP, CERM, 0.01uF, 25V, +/- 5%, C0G/NP0,
0.01uF
AEC-Q200 Grade 1, 0603
CAP, CERM, 22µF, 16V,+/- 20%, X5R, AEC-
22uF
Q200 Grade 3, 1206
0.1uF CAP, CERM, 0.1uF, 25V, +/- 5%, X7R, 0603
CAP, CERM, 0.033µF, 50V,+/- 5%, C0G/NP0,
0.033uF
AEC-Q200 Grade 1, 0805
10uF CAP, CERM, 10µF, 10V,+/- 10%, X7R, 0805
Green LED, Green, SMD
Machine Screw Pan PHILLIPS M3
Bumpon, Hemisphere, 0.44 X 0.20, Clear
ROUND STANDOFF M3 STEEL 5MM
Header, 100mil, 3x1, Tin, TH
Header, 100mil, 14x2, Gold, TH
Header(Shrouded), 19.7mil, 30x2, Gold, SMT
Header, 100mil, 2x1, Gold, TH
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Package Reference Part Number
ADS1282V2EVM
0805 CC0805KKX5R8BB106
0603 CL10B105KA8NNNC
0603 C0603C102J5GACTU
0603 C0603C103F3GACTU
0603 C0603C103J3GECAUTO
1206 CL31A226MOHNNNE
0603 C0603C104J3RACTU
0805 CGA4J2C0G1H333J125AA
0805 GRM21BR71A106KA73L
0603 LED SM0603GCL
RM3X4MM 2701
Transparent Bumpon SJ-5303 (CLEAR)
ROUND STANDOFF M3
9774050360R
STEEL 5MM
Header, 3 PIN, 100mil,
PEC03SAAN
Tin
14x2 Header TSW-114-07-G-D
Header (Shrouded),
QTH-030-01-L-D-A-K-TR
19.7mil, 30x2, SMT
2x1 Header TSW-102-07-G-S
Hardware Design Files
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Yageo
Samsung
Kemet
Kemet
Kemet
Samsung Electro-
Mechanics
Kemet
TDK
MuRata
Bivar
APM HEXSEAL
3M
Wurth Elektronik
Sullins Connector
Solutions
Samtec
Samtec
Samtec
ADS1282EVM-PDK Evaluation Module 27