Processor And Heatsink Installation - Supermicro SuperServer SYS-511E-WR User Manual

3.3 Processor and Heatsink Installation

The processor (CPU) and processor carrier should be assembled together first to form the
processor carrier assembly. This assembly will be then attached to the heatsink to form
the processor heatsink module (PHM) before being installed into the CPU socket. Before
installation, be sure to perform the following steps below:
•
Please carefully follow the instructions given on the previous page to avoid ESD-related
damages.
•
Unplug the AC power cords from all power supplies after shutting down the system.
•
Check that the plastic protective cover is on the CPU socket, and none of the socket pins
are bent. If they are, contact your retailer.
•
When handling the processor, avoid touching or placing direct pressure on the LGA lands
(gold contacts). Improper installation or socket misalignment can cause serious damage
to the processor or CPU socket, which may require manufacturer repairs.
•
Thermal grease is pre-applied on a new heatsink. No additional thermal grease is needed.
•
Refer to the Supermicro website for updates on processor and memory support.
•
The following CPU carrier has been successfully tested in our labs and is available from
Supermicro. Please order the CPU carrier with the CPU.
•
All graphics in this manual are for illustrations only. Your components may look different.
Note: The 4th Gen Intel® Xeon® Scalable Processor comes with three CPU SKUs,
and each SKU supports a distinct carrier. The SP XCC CPU supports Carrier E1A;
HBM CPU supports Carrier E1C, and SP MCC, Carrier E1B.
Chapter 3: Maintenance and Component Installation
CPU Carrier
CPU Type Carrier Part Number
XCC SKT-1333L-0000-FXC
MCC SKT-1424L-001B-FXC
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