Table Of Contents - Infineon AIROC CYW20822-P4TAI040 Manual

AIROC™ Bluetooth® LE module

Table of contents

Table of contents
General description ...........................................................................................................................1
Module description............................................................................................................................1
Power consumption...........................................................................................................................1
Functional capabilities.......................................................................................................................2
Benefits............................................................................................................................................2
More information ..............................................................................................................................2
References........................................................................................................................................2
Technical support..............................................................................................................................3
Table of contents ...............................................................................................................................4
1 Overview .......................................................................................................................................5
1.1 Functional block diagram.......................................................................................................................................5
1.2 Module description .................................................................................................................................................5
1.2.1 Module dimensions and drawing........................................................................................................................5
2 Pad connection interface.................................................................................................................7
3 Recommended host PCB layout........................................................................................................9
4 Functional description ..................................................................................................................12
4.1 Power management .............................................................................................................................................12
4.1.1 PMU configurations ...........................................................................................................................................13
5 Pin assignments ...........................................................................................................................14
5.1 CYW20822-P4XXI040 module pinout....................................................................................................................14
6 Electrical characteristics ...............................................................................................................16
7 PCB antenna performance .............................................................................................................17
7.1 Trace antenna specifications ...............................................................................................................................17
7.2 Trace antenna performance.................................................................................................................................17
8 Environmental specifications ........................................................................................................18
8.1 Environmental compliance ..................................................................................................................................18
8.2 RF certification ......................................................................................................................................................18
8.3 Safety certification................................................................................................................................................18
8.4 Environmental conditions....................................................................................................................................18
8.5 ESD and EMI protection ........................................................................................................................................18
9 Regulatory information.................................................................................................................19
9.1 FCC.........................................................................................................................................................................19
9.2 ISED........................................................................................................................................................................20
9.3 European declaration of conformity....................................................................................................................21
9.4 MIC Japan..............................................................................................................................................................22
10 Packaging ..................................................................................................................................23
11 Ordering information ..................................................................................................................25
12 Acronyms ...................................................................................................................................26
13 Document conventions................................................................................................................30
13.1 Units of measure .................................................................................................................................................30
Revision history ..............................................................................................................................31
Preliminary Datasheet 4 002-38449 Rev. **
2023-08-21