AIROC™ Bluetooth® LE module
Environmental specifications
8
Environmental specifications
8.1
Environmental compliance
This CYW20822-P4xxI040 Bluetooth® LE module is produced in compliance with the Restriction of Hazardous
Substances (RoHS) and Halogen-Free (HF) directives. The Infineon module and components used to produce this
module are RoHS and HF compliant.
8.2
RF certification
The CYW20822-P4xxI040 module will be certified under the following RF certification standards at production
release.
• FCC: WAP822I04
• CE
• ISED: 7922A-822I04
• MIC: TBD
8.3
Safety certification
The CYW20822-P4xxI040 module complies with the following safety regulations:
• Underwriters Laboratories, Inc. (UL): Filing E331901
• CSA
• TUV
8.4
Environmental conditions
Table 11
describes the operating and storage conditions for the Bluetooth® LE module.
Table 11
Environmental conditions for CYW20822-P4xxI040
Description
Operating temperature
Operating humidity (relative, non-condensation)
Thermal ramp rate
Storage temperature
Storage temperature and humidity
ESD: Module integrated into end system
components
[5]
8.5
ESD and EMI protection
Exposed components require special attention to ESD and electromagnetic interference (EMI).
A grounded conductive layer inside the device enclosure is suggested for EMI and ESD performance. Any openings
in the enclosure near the module should be surrounded by a grounded conductive layer to provide ESD
protection and a low-impedance path to ground.
Device handling: Proper ESD protocol must be followed in manufacturing to ensure component reliability.
Note
5. This does not apply to the RF pins (ANT).
Preliminary Datasheet
Minimum specification
–45°C
5%
–
–40 °C
–
–
18
Maximum specification
85°C
85%
3°C/minute
85°C
85°C at 85%
15 kV Air
2.0 kV Contact
002-38449 Rev. **
2023-08-21