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AIROC™ Bluetooth® LE module
Recommended host PCB layout
Table 3
provides the center location for each solder pad on the CYW20822-P4xxI040. All dimensions are refer-
enced to the center of the solder pad. Refer to
Table 3
Module solder pad location
Solder pad
(Center of pad)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
Preliminary Datasheet
Figure 7
for the location of each module solder pad.
Location (X,Y) from
Orign (mm)
(0, 7.10)
(0, 8.35)
(0, 9.6)
(0, 10.85)
(0, 12.10)
(0, 13.35)
(0, 14.60)
(0, 15.85)
(0, 17.10)
(0, 18.35)
(1.5,20.20)
(2.75,20.20)
(4.00,20.20)
(5.25,20.20)
(6.50,20.20)
(7.75,20.20)
(9.00,20.20)
(10.5,18.35)
(10.5,17.10)
(10.5,15.85)
(10.5,14.60)
(10.5,13.35)
(10.5,12.10)
(10.5,10.85)
(10.5,9.6)
(10.5,8.35)
(10.5,7.10)
10
Dimension from
Orign (mil)
(0, 279.53)
(0, 328.74)
(0, 377.95)
(0, 427.16)
(0, 476.38)
(0, 525.59)
(0, 574.80)
(0, 624.01)
(0, 673.23)
(0, 722.44)
(59.06, 795.27)
(108.27, 795.27)
(157.48, 795.27)
(206.69, 795.27)
(255.91, 795.27)
(305.12, 795.27)
(354.33, 795.27)
(413.39, 722.44)
(413.39, 673.23)
(413.39, 624.01)
(413.39, 574.80)
(413.39, 525.59)
(413.39, 476.38)
(413.39, 427.16)
(413.39, 377.95)
(413.39, 328.74)
(413.39, 279.53)
002-38449 Rev. **
2023-08-21
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