Table of Contents
Advertisement
AIROC™ Bluetooth® LE module
Overview
1
Overview
1.1
Functional block diagram
Figure 1
illustrates the CYW20822-P4xxI040 functional block diagram.
2x UART
2x SPI
2x 12C
ADC
UP to 8 PWMs
UP to 12 GPIOs
32kHz LPO_In
(Optional)
Figure 1
Functional block diagram (GPIOs)
1.2
Module description
The CYW20822-P4xxI040 module is a complete module designed to be soldered to the application's main board.
1.2.1
Module dimensions and drawing
Infineon reserves the right to select components from various vendors to achieve the Bluetooth® module
functionality. Such selections will still guarantee that all mechanical specifications and module certifications are
maintained. Designs should be held within the physical dimensions shown in the mechanical drawings in
Figure
2. All dimensions are in millimeters (mm).
Table 1
Module design dimensions
Dimension item
Module dimensions
Antenna connection location dimensions
PCB thickness
Shield height
Maximum component height
Total module thickness (bottom of module to highest
component)
Preliminary Datasheet
XRES
PDM
Passive Components
(RES, CAP, IND)
CYW20822
Silicon Device
1 MB
Embedded Flash
Specification
Length (X)
10.5 ± 0.15 mm
Width (Y)
20.2 ± 0.15 mm
Length (X)
10.6 mm
Width (Y)
6.35 mm
Height (H)
0.80 ± 0.05 mm
Height (H)
1.45-mm typical
Height (H)
1.45-mm typical
Height (H)
2.3-mm typical
5
16 MHz
XTAL
002-38449 Rev. **
2023-08-21
Advertisement
Table of Contents
