Pad Connection Interface - Infineon AIROC CYW20822-P4TAI040 Manual

AIROC™ Bluetooth® LE module

Pad connection interface

2 Pad connection interface
As shown in the bottom view of
the backside of the module.
the CYW20822-P4xxI040 module.
Table 2 Connection description
Part number Name Connections
CYW20822-P4TAI040 SP
CYW20822-P4EPI040 SP
Figure 3 Solder pad dimensions (seen from bottom)
To maximize RF performance, the host layout should follow these recommendations:
1. Antenna Area Keepout: The host board directly below the antenna area of the module (see
contain ground or signal traces. This keepout area requirement applies to all layers of the host board.
2. Module Placement: The ideal placement of the Bluetooth® module is in a corner of the host board with the PCB
trace antenna located at the far corner. This placement minimizes the additional recommended keepout area
stated in item 2. Refer to
Preliminary Datasheet
Figure 2, the CYW20822-P4xxI040 connects to the host board via solder pads on
Table 2 and Figure 3 detail the solder pad length, width, and pitch dimensions of
Connection type
27 Solder pads
27 Solder pads
AN96841 for module placement best practices.
Pad length
dimension
1.05 mm
1.05 mm
7
Pad width
Pad pitch
dimension
0.7 mm 1.25 mm
0.7 mm 1.25 mm
Figure 2) must not
002-38449 Rev. **
2023-08-21