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AN2018-13
IM393 Application note
IM393 IPM Technical Description
About this document
Scope and purpose
The scope of this application note is to describe the IM393 product family and the basic requirements for
operating the products in a recommended mode. This includes integrated components, such as IGBT,
bootstrap functionality or gate drive IC, as well as the design of the necessary external circuitry, interfacing and
application use.
Intended audience
Power electronics engineers who want to design reliable and efficient motor drive application with IM393 IPM
family.
Table of contents
About this document ....................................................................................................................... 1
Table of contents ............................................................................................................................ 1
1
Introduction .......................................................................................................................... 3
1.1
Product line-up ........................................................................................................................................ 4
1.2
Nomenclature .......................................................................................................................................... 5
2
Internal components and package technology .......................................................................... 6
2.1
Power transistor and diode technology ................................................................................................. 6
2.2
Control IC - Six-channel gate driver IC ................................................................................................... 6
2.3
Thermistor ............................................................................................................................................... 7
2.4
Package technology ................................................................................................................................ 8
3
Product overview and pin description ...................................................................................... 9
3.1
Internal circuit and features ................................................................................................................... 9
3.2
Maximum electrical rating .................................................................................................................... 10
3.3
Description of the input and output pins ............................................................................................. 10
3.4
Outline drawings ................................................................................................................................... 15
4
Interface circuit and layout guide ........................................................................................... 17
4.1
Input/output signal connection ............................................................................................................ 17
4.2
Input/output signal connection ............................................................................................................ 19
4.3
Recommended circuit current of power supply .................................................................................. 20
4.4
functions ................................................................................................................................................ 21
4.5
Recommended wiring of shunt resistor and snubber capacitor ......................................................... 21
4.6
Pin and screw hole coordinates for IM393-XX footprint ...................................................................... 23
5
Function and protection circuit ............................................................................................... 25
5.1
Over-current protection ........................................................................................................................ 25
5.1.1
Timing chart of over-current protection (OCP) ............................................................................... 25
5.1.2
Selecting current-sensing shunt resistor ........................................................................................ 26
5.1.3
Delay time ......................................................................................................................................... 27
Application Note
www.infineon.com
Please read the Important Notice and Warnings at the end of this document
page 1 of 53
V 1.0
2019-04-01
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Summary of Contents for Infineon IM393 Series
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Page 1: Table Of Contents
Timing chart of over-current protection (OCP) ................25 5.1.2 Selecting current-sensing shunt resistor ..................26 5.1.3 Delay time ............................27 Application Note Please read the Important Notice and Warnings at the end of this document V 1.0 www.infineon.com page 1 of 53 2019-04-01... - Page 2 IM393 Application note IM393 IPM Technical Description Introduction Fault output and auto-clear function ....................27 Undervoltage lockout (UVLO) ....................... 29 Over-temperature protection ....................... 31 Bootstrap circuit ........................33 Bootstrap circuit operation ........................33 Initial charge of bootstrap capacitor ....................34 Bootstrap capacitor selection ......................
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Page 3: Introduction
The next generation of CIPOS™ IPM from Infineon Technologies has been developed with a focus on improving module efficiency and long-term reliability. The combined benefits of advanced trench IGBT technology and optimized package design have enabled us to achieve higher efficiency and improved reliability, along with minimized module system costs. -
Page 4: Product Line-Up
IM393 Application note IM393 IPM Technical Description Introduction Product line-up Table 1 IM393-XX Products Rating Isolation Internal Part Number Package Main applications Current Voltage Circuit voltage (V Refrigerator IM393-S6E(F) Dryer E(Fully Dish washer molded Washing machine IM393-M6E(F) 10 A Module) 2000 V 3 ф... -
Page 5: Nomenclature
IM393 Application note IM393 IPM Technical Description Introduction Nomenclature Application Note 5 of 53 V 1.0 2019-04-01... -
Page 6: Internal Components And Package Technology
Internal components and package technology Power transistor and diode technology IM393-XX IPM products are based on new Infineon IGBT6 TRENCHSTOP™ technology [1]. This new IGBT generation is based on trench and field-stop technology, and offers significant improvements in terms of loss reduction. -
Page 7: Thermistor
IM393 Application note IM393 IPM Technical Description Internal components and package technology Thermistor All IM393-XX IPMs have internal thermistors to sense the module temperature. Figure 2 shows the correlation between NTC temperature (T ) and the thermistor output voltage which can be used to set the threshold for over-temperature protection. -
Page 8: Package Technology
IM393 Application note IM393 IPM Technical Description Internal components and package technology Figure 2 is valid only for the following conditions: = 300 V PWM sinusoidal modulation phase = 5 A = 16 kHz = 50 Hz MI = 0.8 PF = 0.6 Heat sink R = 1.25 °C/W... -
Page 9: Product Overview And Pin Description
Motor power range from 100 W to 1.5 kW − Fully isolated dual in-line package (DIP) and single in-line package (SIP) molded module − Infineon low- V TRENCHSTOP™ IGBTs with separate freewheeling diode − CE(ON) Undervoltage lockout for all channels −... -
Page 10: Maximum Electrical Rating
IM393 Application note IM393 IPM Technical Description Product overview and pin description Maximum electrical rating Table 3 Detailed description of absolute maximum ratings (IM393-M6E/F case) Item Symbol Rating Description Max. blocking 600 V The sustained collector-emitter voltage of internal IGBTs voltage Output RMS The allowable RMS IGBT collector current at steady state and... - Page 11 IM393 Application note IM393 IPM Technical Description Product overview and pin description VS(V) V-phase high side floating supply offset voltage VB(V) V-phase high side floating supply voltage None VS(U) U-phase high side floating supply offset voltage VB(U) U-phase high side floating supply voltage None Low side control supply Temperature monitor...
- Page 12 IM393 Application note IM393 IPM Technical Description Product overview and pin description The following tables define the SIP type of IM393-XX input and output pins. The detailed functional descriptions are as follows: Name Description Positive bus input voltage None VS(W) / W W-phase high side floating supply offset voltage / W-phase output VB(W) W-phase high side floating supply voltage...
- Page 13 IM393 Application note IM393 IPM Technical Description Product overview and pin description High-side bias voltage pins for driving the IGBT Pins: VB(U) – VS(U) , VB(V) – VS(V), VB(W) – VS(W) These pins provide the gate drive power to the high-side IGBTs. •...
- Page 14 IM393 Application note IM393 IPM Technical Description Product overview and pin description RCIN/Fault/Enable input pin Pin: RFE In case of an over-current event, the FLT/EN pin will get low with the turning ON of the open-drain MOSFET. • This pin is used to post I to switch turn-OFF clear time.
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Page 15: Outline Drawings
IM393 Application note IM393 IPM Technical Description Product overview and pin description Outline drawings Figure 6 DIP version (IM393-X6E) Figure 7 DIP version (IM393-X6E2) Application Note 15 of 53 V 1.0 2019-04-01... - Page 16 IM393 Application note IM393 IPM Technical Description Product overview and pin description Figure 8 DIP version (IM393-X6E3) Figure 9 SIP version (IM393-X6F) Application Note 16 of 53 V 1.0 2019-04-01...
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Page 17: Interface Circuit And Layout Guide
IM393 Application note IM393 IPM Technical Description Interface circuit and layout guide Interface circuit and layout guide Input/output signal connection The following shows the I/O interface circuit between microcontroller and IM393-XX. Because the IPM input logic is active-high with internal pull-down resistors, pulled-up resistors are not required. The RFE output is open-drain MOSFET configured. - Page 18 IM393 Application note IM393 IPM Technical Description Interface circuit and layout guide CIPOS Tiny Input Level shift Gate driver Noise circuit Filter Deadtime & Shoot ≈ k 4 Ω Through Prevention Input Delay Gate driver Noise Filter ≈ Ω Figure 11 Internal structure of signal input terminals Because IM393-XX employs active-high input logic, the power sequence restriction between the control supply and the input signal during start-up or shut-down operation does not exist.
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Page 19: Input/Output Signal Connection
IM393 Application note IM393 IPM Technical Description Interface circuit and layout guide Input/output signal connection Figure 4.3 and 4.4 show a typical application circuit interface schematic with control signals connected directly to the microcontroller. (1) P P (35) P (33) (3) VS(W) (4) VB(W) (6) VS(V) -
Page 20: Recommended Circuit Current Of Power Supply
IM393 Application note IM393 IPM Technical Description Interface circuit and layout guide Notes: 1. Input circuit - RC filter can be used to reduce input signal noise. (100 Ω, 1 nF) - The capacitors should be located close to CIPOS™ Tiny (to COM terminal especially). 2. -
Page 21: Recommended Layout For Over-Current Protection (Ocp) And Short-Circuit Protection (Scp) Functions
IM393 Application note IM393 IPM Technical Description Interface circuit and layout guide Table 7 The recommended minimum circuit current of control power supply (Unit:[mA]) Item The circuit current of +15 V control supply The circuit current of +5 V logic supply ≤... - Page 22 IM393 Application note IM393 IPM Technical Description Interface circuit and layout guide PCB layout example - CIPOS Reference Board CIPOS Capacitor Bank Wiring Leakage Inductance Shunt Resistor Please make the one point connection point as close as possible to the GND terminal of shunt resistor Wiring inductance should be less than 10nH...
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Page 23: Pin And Screw Hole Coordinates For Im393-Xx Footprint
IM393 Application note IM393 IPM Technical Description Interface circuit and layout guide Pin and screw hole coordinates for IM393-XX footprint Figure 16 shows IM393-XX position on the PCB to indicate center coordinates of each pin and screw hole in Table 8 and Table 9. (a) Dual in-line package (b) Single in-line package Figure 16... - Page 24 IM393 Application note IM393 IPM Technical Description Interface circuit and layout guide Table 8 Pin and screw hole coordinates for DIP package (Unit:[mm]) Pin Number Pin Number 0.00 0.00 24.13 3.00 25.40 0.00 2.54 3.00 26.67 3.00 3.81 0.00 Signal pin 27.94 0.00 29.21...
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Page 25: Function And Protection Circuit
IM393 Application note IM393 IPM Technical Description Function and protection circuit Function and protection circuit Over-current protection IM393-XX is equipped with an I input pin. Together with an external shunt resistor, this functionality can be TRIP used to detect over-current events in the negative DC bus. The internal HVIC gate driver will continuously monitor the voltage on the I pin. -
Page 26: Selecting Current-Sensing Shunt Resistor
IM393 Application note IM393 IPM Technical Description Function and protection circuit Table 11 IGBT short-circuit ratings Item Symbol Condition Value Unit Short-circuit withstand time < 150 °C, V = 360 V, V = 15 V μs 5.1.2 Selecting current-sensing shunt resistor The value of the current-sensing resistor is calculated by the following equation: Where is the ITRIP positive-going threshold voltage of IM393-XX. -
Page 27: Delay Time
IM393 Application note IM393 IPM Technical Description Function and protection circuit Table 12 Minimum R and P Minimum shunt resistance, Minimum shunt resistor Product Maximum peak current power, P IM393-X6E/F 30 A 16 mΩ IM393-L6E/F 22.5 A 22 mΩ IM393-M6E/F 15 A 33 mΩ... - Page 28 IM393 Application note IM393 IPM Technical Description Function and protection circuit Input Noise HIN(X) filter HIN(X) Deadtime & Shoot-Through Prevention Input Noise LIN(X) filter LIN(X) Under- voltage detection ITRIP ITRIP Noise ITRIP filter +3.3V RCIN Noise To Microcontroller filter RCIN Figure 18 Internal block diagram of IM393-XX HIN(U, V, W)
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Page 29: Undervoltage Lockout (Uvlo)
IM393 Application note IM393 IPM Technical Description Function and protection circuit It is also important to note that C needs to be minimized in order to make sure it is fully discharged in the RCIN event of over-current. Since the ITRIP pin has a 350 ns input filter, it is appropriate to ensure that C will be RCIN discharged below V... - Page 30 IM393 Application note IM393 IPM Technical Description Function and protection circuit DDUV+ (or V B SUV+ DDUV- (or V BSUV- Ti me UVLO Prot ec tion (Gate Drive Outpu ts Dis ab led) Normal Normal Operation Operation Figure 20 UVLO protection DDUV+ Control Supply Voltage...
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Page 31: Over-Temperature Protection
IM393 Application note IM393 IPM Technical Description Function and protection circuit As the undervoltage lockout function is activated, control input signals are 4 ~ 11.2 blocked, and a fault signal VFO is generated. IGBTs will be operated in accordance with the control gate input. Driving voltage is below the recommended range, so V and the switching losses CE(sat) - Page 32 IM393 Application note IM393 IPM Technical Description Function and protection circuit Vct r CIPOS Tiny Thermistor Figure 24 Circuit proposals for over-temperature protection Vctr = 5 V Vctr = 3.3 V OT set 100℃ : 2.95 V at Vctr = 5 V OT set 100℃...
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Page 33: Bootstrap Circuit
IM393 Application note IM393 IPM Technical Description Bootstrap circuit Bootstrap circuit Bootstrap circuit operation The V voltage, which is the voltage difference between V and V , provides the supply to the IC B (U, V, W) S (U, V, W) within the IM393-XX. -
Page 34: Initial Charge Of Bootstrap Capacitor
IM393 Application note IM393 IPM Technical Description Bootstrap circuit Table 16 Electrical characteristics of internal bootstrap parameters Value Item Symbol Unit Min. Typ. Max. Bootstrap resistance Ω Initial charge of bootstrap capacitor Adequate on-time duration of the low-side IGBT to fully charge the bootstrap capacitor is required for initial bootstrap charging. -
Page 35: Charging And Discharging Of The Bootstrap Capacitor During Pwm Inverter Operation
IM393 Application note IM393 IPM Technical Description Bootstrap circuit = maximum discharge current of the C mainly via the following mechanisms: • leak Gate charge for turning on the high-side IGBT − Quiescent current to the high-side circuit in the IC −... - Page 36 IM393 Application note IM393 IPM Technical Description Bootstrap circuit [kHz] Figure 29 Bootstrap capacitance as a function of the switching frequency Figure 29 shows the curve for a continuous sinusoidal modulation. If the voltage ripple is 0.1 V, the recommended bootstrap capacitance is therefore in the range of 4.7 µF for most switching frequencies. In case of other PWM method like a discontinuous sinusoidal modulation, the t must be set to the longest period of charge...
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Page 37: Thermal Design
IM393 Application note IM393 IPM Technical Description Thermal design Thermal design Introduction Thermal design is a key issue for the IM393-XX that is to be built into in electronic systems such as drives. In order to avoid overheating and/or to increase reliability, two design criteria are of importance: Low power losses •... -
Page 38: Power Losses
IM393 Application note IM393 IPM Technical Description Thermal design Power losses The total power losses in the IM393-XX are composed of conduction and switching losses in the IGBTs and diodes. The loss during the turn-off steady state can be ignored, as it is very low and has little effect on increasing the temperature in the device. -
Page 39: Switching Losses
IM393 Application note IM393 IPM Technical Description Thermal design 7.2.2 Switching losses Different devices have different switching characteristics, and vary according to the handled voltage/current and operating temperature/frequency. However, the turn-on/off energy loss (joule) can be experimentally measured, indirectly, by integrating power over time where power is obtained by multiplying the current and voltage, under a given circumstance. -
Page 40: Temperature Rise Considerations And Calculation Example
IM393 Application note IM393 IPM Technical Description Thermal design Figure 32 Thermal impedance curve of IM393-M6F Temperature rise considerations and calculation example The simulator PLECS allows users to estimate power losses and temperature profiles for a constant case temperature. The result of loss calculation using the typical characteristics is shown in Figure 33 as “max RMS output current versus carrier frequency”. - Page 41 IM393 Application note IM393 IPM Technical Description Thermal design Figure 33 Max RMS output current versus carrier frequency at T = 150 C [5] Under sinusoidal modulation, the power loss has to be calculated in each switching cycle, as the device current changes within half-modulation cycle, as illustrated in Figure 34.
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Page 42: Heat Sink Selection Guide
IM393 Application note IM393 IPM Technical Description Thermal design Figure 35 Junction temperature calculation under sinusoidal modulation Heat sink selection guide 7.5.1 Required heat sink performance If the power losses P and the maximum ambient temperature are known, the required thermal sw,i th,J-C resistance of the heat sink and the thermal interface material can be calculated according to Figure 31 from,... -
Page 43: Heat Sink Characteristics
IM393 Application note IM393 IPM Technical Description Thermal design 7.5.2 Heat sink characteristics Heat sinks are characterized by three parameters: Heat transfer from the power source to heat sink • Heat transfer within the heat sink (to all the surfaces of the heat sink) •... - Page 44 IM393 Application note IM393 IPM Technical Description Thermal design increasing the number of fins does not necessarily reduce the thermal resistance as discussed in section Error! R eference source not found.. Heat transfer coefficient (aerodynamics): This coefficient is strongly depending on the air flow velocity as •...
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Page 45: Selecting A Heat Sink
Also ensure that the fin spacing is optimized for the corresponding flow conditions. Online simulation tool Infineon has developed an online simulation tool based on PLECS™ to help designers select the proper module that fits their system. The online tool can be found at: https://plex.infineon.com/plexim/ipmmotor.html... - Page 46 IM393 Application note IM393 IPM Technical Description Thermal design Figure 38 Motor drive with fixed case temperature Figure 39 Motor drive with fixed heat sink characteristics Application Note 46 of 53 V 1.0 2019-04-01...
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Page 47: Heat Sink Mounting And Handling Guidelines
IM393 Application note IM393 IPM Technical Description Heat sink mounting and handling guidelines Heat sink mounting and handling guidelines Heat sink mounting 8.1.1 General guidelines An adequate heat-sinking capability of the IM393-XX is only achievable if it is suitably mounted. This is the fundamental requirement for meeting the electrical and thermal performance of the module. -
Page 48: Screw Tightening To Heat Sink
IM393 Application note IM393 IPM Technical Description Heat sink mounting and handling guidelines Table 18 Mechanical characteristics and ratings Limits Item Condition Unit Min. Typ. Max. Mounting torque Mounting screw : M3 N⋅m Curvature of (Note Figure 40) μm module backside Figure 40 Backside curvature measurement position 8.1.1.2... -
Page 49: Handling Guideline
IM393 Application note IM393 IPM Technical Description Heat sink mounting and handling guidelines Figure 41 Recommended screw tightening order Handling guideline When installing a module to a heat sink, excessive uneven tightening force might apply stress to inside chips, which will lead damage to the device. An example of a recommended fastening order is shown in Figure 41. Do not over-torque when mounting the screws. -
Page 50: Storage Guideline
IM393 Application note IM393 IPM Technical Description Heat sink mounting and handling guidelines Storage guideline 8.3.1 Recommended storage conditions Temperature: 5 ~ 35 °C Relative humidity: 45 ~ 75 % Avoid leaving the IM393-XX IPM exposed to moisture or direct sunlight. Especially be careful during periods of •... -
Page 51: References
IM393 Application note IM393 IPM Technical Description References References Product brief - Trenchstop igbt6, https://www.infineon.com/dgdl/Infineon-TRENCHSTOP+IGBT6-PB- v01_00-EN.pdf?fileId=5546d4625ee5d4cd015ef02060412593 Industrial and general purpose gate driver ICs, https://www.infineon.com/dgdl/Infineon- Selection_Guide_Gate_Driver_ICs-SG-v01_00-EN.pdf?fileId=5546d46250cc1fdf015110069cb90f49 W. Frank, J. Oehmen, A. Arens, D. Chung, J. Lee, “A new intelligent power module for home appliances”, Proceedings of PCIM 2009, Nuremberg, Germany D. -
Page 52: Revision History
IM393 Application note IM393 IPM Technical Description Revision history Revision history Document Date of release Description of changes version 2019-04-01 First release Application Note 52 of 53 V 1.0 2019-04-01... - Page 53 For information on the types Do you have a question about this given in this application note. in question please contact your nearest Infineon document? Technologies office. The data contained in this document is exclusively Email: erratum@infineon.com...
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