Table Of Contents - Infineon AIROC CYW20835 User Manual

Bluetooth le system on chip hardware design guidelines
Table of Contents

Advertisement

AIROC™ CYW20835 Bluetooth® LE system on chip hardware design
guidelines

Table of contents

Table of contents
About this document ....................................................................................................................... 1
Table of contents ............................................................................................................................ 2
1
Basic layout guidelines ........................................................................................................... 3
2
Component placement ........................................................................................................... 4
2.1
Antenna placement ................................................................................................................................. 4
2.2
PCB antenna ............................................................................................................................................ 4
2.3
Crystal placement ................................................................................................................................... 4
2.4
Decoupling capacitors ............................................................................................................................ 5
2.5
Ground vias .............................................................................................................................................. 5
2.6
Bandpass filter ......................................................................................................................................... 5
2.7
Analog mic signals ................................................................................................................................... 5
2.8
Serial flash ............................................................................................................................................... 6
2.9
Layer 2, solid ground fill .......................................................................................................................... 6
2.10
Power traces ............................................................................................................................................ 6
2.11
Avoid routing DC power in a loop ............................................................................................................ 6
2.12
Power inductor ........................................................................................................................................ 7
2.13
Layer 4 ...................................................................................................................................................... 8
2.14
Assembly instructions ............................................................................................................................. 9
Revision history............................................................................................................................. 10
User Guide
2 of 11
002-34024 Rev. **
2021-10-05

Advertisement

Table of Contents
loading

Table of Contents