Operating Elements In The Service Lid; Access To Dip Switch And To The Μsd Card Via The Service Lid - Bender ISOMETER isoPV1685RTU Manual

4.3.2

Operating elements in the service lid

The representation below shows the position of the operating elements
1
A4
2 A3
3 A2
A1
4
SS8103
A0
5
6
7
8
ST6101
µSDCard
4.3.3 Access to DIP switch and to the µSD card via the service lid
Open the service lid by pressing gently on the ribbed surface and pulling the lid from the
enclosure away.
After removing the lid the following settings can be carried out:
• Changing the BMS address or the Modbus address (SS8103)
• Setting the maximum leakage capacitance (SS8103)
• Changing the measurement speed (SS8103)
• Resetting alarms (ST6101)
In addition, you can access the µSD card to read out stored alarms, for example.
For a description of the DIP switches, refer to
capacitance or measurement speed
22
Operating
elements
isoPV1685RTU:
• Switching between BMS and Modbus: A4
• BMS /Modbus address setting: A3...A0
• Leakage capacitance setting
DIP switch
• Measurement speed setting
(SS8103)
isoPV1685P:
• BMS address setting: A4...A0
• Leakage capacitance setting
• Measurement speed setting
Button
• Alarm reset
(ST6101)
Memory card • Memory for log files and history memory
(µSD card) (µSD card);
isoPV1685 iso1685FR
® ®
ISOMETER ISOMETER
ON ON
PGH ON
SERVICE SERVICE
ALARM 1 ALARM 1
ALARM 2 ALARM 2
ALARM 3 (I n)
∆
Chapter 7.3 Setting the system leakage
on page 31.
Function
isoPV1685xxx_D00007_08_M_XXEN/03.2023
Device overview