Table of Contents
1 High-Density EVM Description..............................................................................................................................................
Applications............................................................................................................................................................3
Specifications..........................................................................................................................................4
Photo...............................................................................................................................................................................5
4.1 EVM Setup.........................................................................................................................................................................
4.2 EVM Connections..............................................................................................................................................................
4.3 EVM Performance Validation.............................................................................................................................................
5.1 EMI Performance...............................................................................................................................................................
5.2 Surge Immunity..................................................................................................................................................................
6 EVM Documentation.............................................................................................................................................................
6.1
Schematic.........................................................................................................................................................................11
Materials.................................................................................................................................................................12
6.3 PCB Layout......................................................................................................................................................................
Drawings..........................................................................................................................................................16
6.5 Multi-Layer Stackup.........................................................................................................................................................
Support.................................................................................................................................................................18
7.2 Documentation Support...................................................................................................................................................
Figure 6-1. EVM Schematic.......................................................................................................................................................
Figure 6-2. 3D Top View............................................................................................................................................................
View.......................................................................................................................................................13
Copper....................................................................................................................................................14
Copper........................................................................................................................................................14
Copper........................................................................................................................................................15
Figure 6-10. Layer Stackup.......................................................................................................................................................
Table 4-1. EVM Header Connections..........................................................................................................................................
Table 6-1. EVM Component BOM.............................................................................................................................................
Trademarks
HotRod
™
is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
2
TPSF12C3QEVM Active EMI Filter Evaluation Module for Three-Phase AC
Power Systems
Table of Contents
Performance.................................................................................................................................3
Validation..............................................................................................................................6
Support...................................................................................................................................18
List of Figures
Photo............................................................................................................................................5
List of Tables
Specifications.........................................................................................................................4
Copyright © 2023 Texas Instruments Incorporated
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SLVUCM2 - JANUARY 2023
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