High-Density Evm Description; Typical Applications; Features And Electrical Performance - Texas Instruments TPSF12C3QEVM User Manual

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1 High-Density EVM Description

The TPSF12C3QEVM features the TPSF12C3-Q1 active EMI filter (AEF) IC designed to reduce common-mode
(CM) electromagnetic interference (EMI) in three-phase AC power systems. The AEF solution configured with
voltage sense and current inject (VSCI) uses a capacitive multiplier circuit to emulate the Y-capacitors in a
conventional passive filter design. The device senses the CM voltage disturbance on the power lines of a
three-phase, three-wire or four-wire system using a set of sense capacitors and injects a noise-canceling current
back into the power lines using an injection capacitor. The effective active capacitance is set by the AEF circuit
gain and the injection capacitance. The AEF sensing and injection impedances use relatively low capacitance
values with small component footprints – no magnetic components required. The device includes integrated
filtering, compensation and protection circuitry, and an enable input.
The TPSF12C3-Q1 provides a very low impedance path for CM noise in the frequency range of interest for
EMI measurement. Enabling up to 25 dB of CM noise reduction at the lower end of specified frequency ranges
(for example, 100 kHz to 3 MHz) significantly reduces the footprint, volume, weight and cost of the CM filter
implementation, especially the CM choke components that are designed to attenuate lower-order harmonics
– and hence are large size. The resultant lower size of the CM chokes implies reduced parasitic winding
capacitance, which serves to improve attenuation at high frequencies.
Acting as a daughter board, this low-voltage EVM provides a header to facilitate easy connection to the EMI filter
passive components, which typically includes the common-mode chokes and Y-capacitors. The header terminals
provide connections to:
• Four sense capacitors
• An inject capacitor
• VDD bias supply: 8 V to 16 V (typical 12 V)
• A remote ON, OFF signal
• Chassis ground
The recommended PCB layout

1.1 Typical Applications

• On-board charger (OBC) for electric vehicles
• Welders and other industrial systems
• Three-phase AC/DC regulators for
• Inverters and motor drives

1.2 Features and Electrical Performance

• Improved common-mode
– Helps to meet EMI standards, such as CISPR 11 and CISPR 32 Class B (for ISM and multimedia
applications, respectively) or CISPR 25 Class 5 (for automotive)
– Voltage-sense, current-inject AEF solution presents low impedance over the EMI frequency range
• Up to 25 dB reduction in the common-mode EMI signature from 100 kHz to 3 MHz
• Reduces the size, weight and cost of the common-mode chokes
• Simple external configuration for three-phase AC power systems
– Integrated sensing filter and summing network
– Low Y-capacitor touch current at line frequency maintains safety
– Simplified compensation network
• Inherent protection features for robust and reliable design
– Withstands 5-kV surge with minimal external component count
• Helps meet IEC 61000-4-5 surge immunity specification when operating in the electrical installation
• Integrated surge protection at the SENSE inputs
– Wide supply voltage (VDD) range of 8 V to 16 V, nominally 12 V
• VDD undervoltage lockout (UVLO) set to turn on and off at 7.7 V and 6.7 V, respectively
– 175°C thermal shutdown protection with hysteresis
– Integrated pullup resistor from VDD to EN allows use of an open-drain/collector device for disable function
• Fully assembled, tested and proven 4-layer
• The EVM includes a right-angle header for easy hookup to an EMI filter board
SLVUCM2 – JANUARY 2023
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minimizes overall noise signature and required board area.
servers and telecom
EMI performance for applications with three-phase AC inputs
PCB design
Copyright © 2023 Texas Instruments Incorporated
with total footprint of 1" × 0.8" (25.4 mm × 20.3 mm)
TPSF12C3QEVM Active EMI Filter Evaluation Module for Three-Phase AC
High-Density EVM Description
3
Power Systems