Pcb Removal - Lenovo motorola Moto Z Droid Service And Repair Manual

Moto Z (Droid) / Moto Z
Level 2 – Service and Repair Manual

PCB Removal

NOTE
The PCB can be recovered and
reused after removal.
1. Use the flat end of the Blackstick to disconnect
the Side-Key Flex BtB Connector.
2. Remove the Kapton Tape from the 3IP Machine
Screw in the PCB.
NOTE
After you remove the Kapton Tape, you
cannot reuse it.
3. Use the Torque Driver and 3IP Torx Bit to
remove the 3IP Machine Screw from the PCB.
NOTE
After you remove the 3IP Machine Screw,
you cannot reuse it.
4. Place the Sheridan Lens Adhesive Heating Plate
(3-00-J7-10000) on the Hot Plate.
5. Set the Hot Plate to 70 °C (158 °F).
// CAUTION //
Do not set the Hot Plate temperature higher than
70 °C (158 °F). Damage to the phone may occur.
6. Wait 10-15 minutes for the Hot Plate to warm up.
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