1.4
MEB AND MEB II DIFFERENCES
Table 1-1
generation boards.
TABLE 1-1:
MEB BOARD DIFFERENCES
Feature
Starter Kit Connector 160-pin Hirose FX10 series board-to-board
connector
Starter Kit
Refer to:
Display
Low-Cost Controllerless (LCC) graphics
60-pin display connector
Includes a 4.3" WQVGA display with projected
capacitive touch(MTCH6301)
Supports up to 7" WVGA display through a
connector
External SRAM (EBI) ISSI 2 MB external synchronous RAM
(IS61WV102416BLL-10TLI)
VGA Camera
Available on board
Audio
24-bit audio codec (AK4953A)
®
Bluetooth
Low cost Bluetooth™ HCI transceiver
Wi-Fi
IEEE 802.11b/g (MRF24WG0MA) transceiver
module
Accelerometer
ADXL325 3-axis analog accelerometer
Temperature Sensor
MCP9700T analog temperature sensor
microSD
Connects to Host CPU on the starter kit
mTouch™ Buttons
Two touch buttons; additional touch button
support through a PICtail™ connector
PICtail™ Connector
Yes
EEPROM
N/A
SPI Flash
See Note 1
CPLD
See Note 2
Joystick
N/A
Note 1:
Serial Quad Flash support through the PIC32 Starter Kit.
2:
Port enhancement is not necessary due to extended connector and available device pins.
© 2013-2014 Microchip Technology Inc.
describes the differences between the first (MEB) and second (MEB II)
MEB II
http://www.microchip.com/meb2
Introduction
MEB
132-pin Hirose FX10 series board-to-board
connector
Refer to:
http://www.microchip.com/meb
On-board graphics controller (SSD1926)
N/A
3.2" QVGA display with resistive touch
N/A
N/A
N/A
24-bit audio codec (WM8731)
N/A
IEEE 802.11b (MRF24WB0MA) transceiver
module
BMA150 3-axis digital accelerometer and
temperature sensor
Temperature sensor in BMA150
Connects to the graphics controller
Touch button support through a PICtail™
connector
Yes
128-byte EEPROM (24LC08)
2 MB SST25VF016 serial Flash
Xilinx XC2C64A for port enhancement
Available
DS70005148B-page 17
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