Power Pod, Processor Or Thermal Blank Removal - IBM xSeries 380 Hardware Maintenance Manual

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Power pod, processor or thermal blank removal

Complete the following actions to remove a processor or thermal blank.
Note:
Read "Before you begin" on page 136.
Read "Safety information" on page 257 .
Read "Handling electrostatic discharge-sensitive devices" on page 260.
1.
Remove the Processor/Memory Complex. See "Processor/memory complex
removal" on page 177.
2.
Orient the complex such that you have access to the surface from which you are
removing processors or thermal blanks.
3.
Loosen the four thumbscrews that secure the triple-beam to the sides of the
Processor/Memory Complex.
4.
Remove the sheet metal baffle located to the front of the processors or thermal
blanks in the Processor/Memory Complex. To remove the baffle, open the plastic
latch blocking the opening ( 1 ) and pull in the flexible retaining tabs ( 2 ) and
slide the baffle out.
With the four thumbscrews ( 1 ) from step 3. loosened, loosen the 14 captive
5.
screws ( 2 ) in the triple-beam.
FRU information (service only)
181

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