Nvidia Jetson Orin NX Design Manual page 56

Parameter
Min Trace spacing (Pair-Pair)
Stripline: 2.1
Stripline: 1.4b/2.0
Microstrip: 2.1
Microstrip: 1.4b/2.0
Trace spacing (Main link to DDC)
Stripline
Microstrip
Max Total Delay (2.1)
Stripline (4x spacing)
Microstrip (7x spacing)
Max Total Delay (1.4b/2.0)
Stripline
Microstrip (5x spacing)
Microstrip (7x spacing)
Max intra-pair (within pair) skew
Max inter-pair (pair to pair) skew
Max GND transition via distance
Via
Topology
Minimum impedance dip
Recommended via dimension
drill/pad
Antipad
via pitch
GND via
Connector pin via
Max # of vias
PTH via
u-via
Max via stub length
Topology
The main route via dimensions should comply with the via structure rules (See via
section)
For the connector pin vias, follow the rules for the connector pin vias (See via section)
The traces after main route via should be routed as 100Ω differential or as uncoupled
50ohm SE traces on PCB top or bottom.
Max distance from R to main trace (seg B)
PD
Max distance from AC cap to RPD stubbing
point (seg A)
Max distance between ESD and signal via
Add-on Components
Example of a case where space is limited for
placing components.
PRELIMINARY INFORMATION
NVIDIA Jetson Orin NX
Requirement Units
4x dielectric
3x
7x
5x to 7x
3x dielectric
5x
76 (535) mm (ps)
63.5 (375)
101 (700) mm (ps)
88.5 (525)
101 (600)
0.15 (1) mm (ps)
150
1x Diff pair via pitch For signals switching reference layers,
- Y-pattern is recommended
- keep symmetry
97 Ω@200ps
92 Ω@35ps
200/400 uM
840
880
Place GND via as symmetrically as
possible to data pair vias. Up to four
signal vias (2 diff pairs) can share a
single GND return via
The break-in trace to the connector pin
via should be routed on the BOTTOM in
order to avoid via stub effect
Equal spacing (0.8mm) between
adjacent signal vias.
The x-axis distance between signal and
GND via should be > 0.6mm
2 if all vias are PTH via
Not limited if total channel loss
meets IL spec.
0.4 mm
1 mm
~0 mm
3 mm
Top: See Figure 9-16
Notes
For Stripline, this is 3x of the thinner of
above and below.
For Stripline, this is 3x of the thinner of
above and below.
Propagation delay: 6.9ps/mm
assumption for Stripline, 5.9ps/mm for
Microstrip.
Propagation delay: 6.9ps/mm
assumption for Stripline, 5.9ps/mm for
Microstrip.
See notes 1, 2, and 3
ps See notes 1, 2, and 3
add one or two ground stitching vias. It is
recommended they be symmetrical to
signal vias.
Xtalk suppression is the best by Y-
pattern. Also it can reduce the limit of
pair-pair distance. Need review
(NEXT/FEXT check) if via placement is
not Y-pattern. See Figure 9-12
GND via is used to maintain return path,
while its Xtalk suppression is limited
See Figure 9-13
No breakout: ≤ 3 vias: See Figure 9-14
Breakout on the same layer as main
trunk: ≤ 4 vias: See Figure 9-15
long via stub requires review (IL and
resonance dip check)
See topology in Figure 9-9
Bottom: See Figure 9-17
DG-10931-001_v0.1 | 48
Display