Nvidia Jetson Orin NX Design Manual page 51

Parameter
Stripline
Microstrip
Trace spacing (Pair-Pair)
Stripline
Microstrip (HBR/RBR)
Microstrip (HBR2/HBR3)
Trace spacing (Main Link to AUX):
Stripline/Microstrip
Max Intra-pair (within pair) Skew
Max Inter-pair (pair-pair) Skew
Via
Max GND transition Via distance
Impedance dip
Recommended via dimension for impedance control
Drill/Pad
Antipad
Via pitch
Topology
GND via
Max # of Vias
PTH vias
Micro Vias
Max Via Stub Length
AC Cap
Value
Max Dist. from AC cap to connector
RBR/HBR
HBR2/HBR3
Voiding
RBR/HBR
HBR2/HBR3
Serpentine (See USB 3.2 Guidelines)
PRELIMINARY INFORMATION
NVIDIA Jetson Orin NX
Requirement Units
162 (1120)
155 (900)
3x dielectric height
4x
5x to 7x
3x / 5x dielectric height
0.15 (1) mm (ps)
150 ps
< 1x diff pair pitch
≥97 Ω @ 200ps
≥92 Ω @ 35ps
200/400 um
>840 um
≥880 um
Y-pattern is recommended
keep symmetry
Xtalk suppression is best using the Y-
pattern. It can also reduce the limit of
pair-pair distance.
For in-line via, the distance from a via
of one lane to the adjacent via from
another lane >= 1.2 mm center-
center.
Place GND via as symmetrically as
possible to data pair vias. Up to 4
signal vias (2 diff pairs) can share a
single GND return via
4 if all vias are PTH via
Not limited if total channel loss meets
IL spec
0.4 mm
0.1 uF
No requirement in
0.5
No requirement
Voiding required
Display
Notes
Do not perform length (delay) matching
within breakout region. Do trace length
(delay) matching before hitting discontinuity
(i.e. matching to <1ps before the vias or any
discontinuity to minimize common mode
conversion).
For signals switching reference layers, add
symmetrical GND stitching Via near signal
Vias.
The via dimension must be required for the
HDMI-DP co-layout condition.
See Figure 9-6.
See Figure 9-7.
GND via is used to maintain return path,
while its Xtalk suppression is limited
Discrete 0402
HBR2: Voiding the plane directly under the
pad ~0.1mm larger than the pad size is
recommended.
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