Package; Package Selection; Table 4. Package Summary (Excluding Wcsp) - ST STM32F4 Series Getting Started

Package

3 Package
3.1

Package Selection

Package should be selected by taking into account the constrains that are strongly
dependent upon the application.
The list below summarizes the more frequent ones:
–
–
–
–
–
–
(1)
Size (mm)
Pitch (mm)
Height (mm)
Sales numbers
STM32F405xx / 407xx
/ 415xx / 417xx
STM32F42xxx / 43xxx
STM32F401xB/C
STM32F401xD/E
STM32F411xx
STM32F446XX
1. body size, excluding pins
18/44
Amount of interfaces required.
Some interfaces might not be available on some packages.
Some interfaces combinations could not be possible on some packages
PCB technology constrains.
Small pitch and high ball density could require more PCB layers and higher class
PCB
Package height
PCB available area
Noise emission or signal integrity of high speed interfaces.
Smaller packages usually provide better signal integrity. This is further enhanced
as Small pitch and high ball density requires multilayer PCBs which allow better
supply/ground distribution.
Compatibility with other devices.

Table 4. Package summary (Excluding WCSP)

0.5 0.5 0.5
0.6 1.6 1.6
- X X
- - X
X X X
X X X
X X X
- X X
DocID026304 Rev 3
0.5 0.5 0.5 0.8
0.6 1.6 0.6 0.6
- X -
- X -
X - -
X - -
X -
- X X
0.5 0.5 0.65
1.6 0.6 0.6
- X - X
- X X X
- - - -
- - - -
- - -
X - - -
AN4488
0.5 0.8
1.6 1.1
- -
X X
- -
- -
- -
- -