Introduction; Com Express™ Extension Specification; Com Express™ Design Guide; Com Express™ Computer-On-Module - Kontron COM Express Extension Specification

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Table of Contents

Introduction

2.1

COM Express™ Extension Specification

The COM Express™ Extension Specification builds on the COM Express™ (COM.0) standard as

defined by the PCI Industrial Computer Manufacturers' Group (PICMG®) which is an industry

standard adopted for Computer-On-Modules. The COM Express™ Extension Specification is focused

with its intellectual properties on the deep embedded market and is intended to be an add-on to the

PICMG's COM Express™ COM.0 Specification. It is the intention of the authors of this specification

to propose the information contained here within to PICMG® as a means of updating the current

COM Express™ standard to ensure continued saleability and compatibility of all COM Express™

solutions.

2.2

COM Express™ Extension Design Guide

The COM Express™ Design Guide, a separate document from both the PICMG® COM Express™

Specification and this COM Express™ Extension Specification, is available to COM Express™ module

customers upon request. For download the COM Express™ Extension Design guide please visit our

web page:

http://www.comexpress-extension.com/specs/specs.php

The COM Express™ Design Guide explores the requirements of the COM Express™ Extension

Specification and provides recommendations on designing COM Express™ baseboards to support

various features of COM Express™ compliant modules.

The COM Express™ Design Guide, based upon the COM Express™ Extension Specification and

PICMG® COM Express™ Specification, discusses capabilities in the specification with schematic

examples where applicable and offers ideas to consider for maximum flexibility in designing

baseboards.

2.3

COM Express™ Computer-On-Module

A COM Express™ Computer-On-Module (COM) is a module with all components necessary for a

bootable host computer, packaged as a super component. COMs require a carrier board in order to

bring out I/O and to power up the CPU module.

COMs are used to build single board computer solutions and offer OEMs fast time-to-market with

reduced development cost.

Like integrated circuits, they provide OEMs with significant freedom when working to meet form-fit-

function requirements. For all of these reasons, COM methodology has gained significant popularity

with OEMs in the embedded industry. The COM Express™ standard is designed to be future proof

and to provide a smooth transition path from legacy parallel interfaces to LVDS (Low Voltage

Specification Rev 013

2 Introduction

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