Mounting Example With External Heat Sink - SIEB & MEYER SD2 Series Hardware Description

Mounting Example with External Heat Sink

10 Mounting Example with External
Heat Sink
Devices without integrated heat sink (0362110xxy, 0362111xy, 0362111MF, 0362112xxy,
0362130xxy und 0362190y) are cooled via the rear panel. In order to ensure optimum
cooling a heat sink must be mounted.
The used kind of cooling system must be suitable for the application. Insufficient cooling
may cause damage to the devices due to overheating.
The following sections describe 3 examples of device mounting with heat sink.
Note
For better heat conductance, use adequate heat-conductive paste.
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