Device Variant 0362115Xxy (Max. 120 A) With Integrated Heat Sink - SIEB & MEYER SD2 Series Hardware Description

7.4 Device Variant 0362115xxy (max. 120 A) with
Integrated Heat Sink
Fig. 49: Device view 0362115xxy
Restriction of cooling air flow
If the air flow cooling the device is obstructed, the device could overheat and possibly
become damaged.
→ When installing the device, pay attention to the direction of air flow through the in-
ternally installed fan [arrows].
→ For sufficient cooling the ventilation inlets and outlets must be kept free by a space
of min. 10 cm.
The device is designed for vertical wall mounting. Other setup positions are possible but
you must consult SIEB & MEYER before.
Drive System SD2 - Hardware Description
Double-axis Drive Amplifiers
NOTICE
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